ZHCSGX8E march   2017  – june 2023 TPS61253A , TPS61253E

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Start-up
      2. 8.3.2 Enable and Disable
      3. 8.3.3 Undervoltage Lockout (UVLO)
      4. 8.3.4 Current Limit Operation
      5. 8.3.5 Load Disconnection
      6. 8.3.6 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Auto PFM Mode
      2. 8.4.2 Forced PWM Mode
      3. 8.4.3 Ultrasonic Mode
      4. 8.4.4 Pass-Through Mode
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Custom Design With WEBENCH® Tools
        2. 9.2.2.2 Inductor Selection
        3. 9.2.2.3 Output Capacitor
        4. 9.2.2.4 Input Capacitor
        5. 9.2.2.5 Checking Loop Stability
        6. 9.2.2.6 Application Curves
      3. 9.2.3 System Examples
  11.   Power Supply Recommendations
  12. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  13. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 第三方产品免责声明
      2. 11.1.2 Development Support
        1. 11.1.2.1 Custom Design With WEBENCH® Tools
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 接收文档更新通知
    4. 11.4 支持资源
    5. 11.5 Trademarks
    6. 11.6 静电放电警告
    7. 11.7 术语表
  14.   Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

9.2.2.4 Input Capacitor

Multilayer ceramic capacitors are an excellent choice for input decoupling of the step-up converter since they have extremely low ESR and are available in small footprints. Input capacitors should be located as close as possible to the device. While a 4.7-μF input capacitor is sufficient for most applications, larger values can be used to reduce input current ripple without limitations.

Take care when using only ceramic input capacitors. When a ceramic capacitor is used at the input and the power is being supplied through long wires, such as from a wall adapter, a load step at the output can induce ringing at the VIN pin. This ringing can couple to the output and be mistaken as loop instability or could even damage the part. Additional "bulk" capacitance (electrolytic or tantalum) should in this circumstance be placed between CIN and the power source lead to reduce ringing that can occur between the inductance of the power source leads and CIN.