SLVSB43C November   2011  – February 2016 TPS54427

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 PWM Operation
      2. 7.3.2 PWM Frequency and Adaptive On-Time Control
      3. 7.3.3 Soft Start and Pre-Biased Soft Start
      4. 7.3.4 Current Protection
      5. 7.3.5 UVLO Protection
      6. 7.3.6 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Forced CCM Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Output Voltage Resistors Selection
        2. 8.2.2.2 Output Filter Selection
        3. 8.2.2.3 Input Capacitor Selection
        4. 8.2.2.4 Bootstrap Capacitor Selection
        5. 8.2.2.5 VREG5 Capacitor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Design Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

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10 Layout

10.1 Layout Guidelines

  1. The TPS54427 can supply relatively large current up to 4A. So heat dissipation may be a concern. The top side area adjacent to the TPS54427 should be filled with ground as much as possible to dissipate heat.
  2. The bottom side area directly below the IC should a dedicated ground area. It should be directed connected to the thermal pad of the using vias as shown. The ground area should be as large as practical. Additional internal layers can be dedicated as ground planes and connected to vias as well.
  3. Keep the input switching current loop as small as possible.
  4. Keep the SW node as physically small and short as possible to minimize parasitic capacitance and inductance and to minimize radiated emissions. Kelvin connections should be brought from the output to the feedback pin of the device.
  5. Keep analog and non-switching components away from switching components.
  6. Make a single point connection from the signal ground to power ground.
  7. Do not allow switching current to flow under the device.
  8. Keep the pattern lines for VIN and PGND broad.
  9. Exposed pad of device must be connected to PGND with solder.
  10. VREG5 capacitor should be placed near the device, and connected PGND.
  11. Output capacitor should be connected to a broad pattern of the PGND.
  12. Voltage feedback loop should be as short as possible, and preferably with ground shield.
  13. Lower resistor of the voltage divider which is connected to the VFB pin should be tied to SGND.
  14. Providing sufficient via is preferable for VIN, SW and PGND connection.
  15. PCB pattern for VIN, SW, and PGND should be as broad as possible.
  16. VIN Capacitor should be placed as near as possible to the device.

10.2 Layout Examples

TPS54427 layout_lvsb43.gif Figure 22. TPS54427 Layout
TPS54427 layout_DRC_lvsau1.gif Figure 23. PCB Layout for the DRC Package

10.3 Thermal Considerations

This 8-pin DDA package incorporates an exposed thermal pad that is designed to be directly to an external heatsink. The thermal pad must be soldered directly to the printed board (PCB). After soldering, the PCB can be used as a heatsink. In addition, through the use of thermal vias, the thermal pad can be attached directly to the appropriate copper plane shown in the electrical schematic for the device, or alternatively, can be attached to a special heatsink structure designed into the PCB. This design optimizes the heat transfer from the integrated circuit (IC).

For additional information on the exposed thermal pad and how to use the advantage of its heat dissipating abilities, refer to Technical Brief, PowerPAD™ Thermally Enhanced Package, SLMA002 and Application Brief, PowerPAD™ Made Easy, SLMA004.

The exposed thermal pad dimensions for this package are shown in the following illustration.

TPS54427 thermal_pad_lvsb43.gif Figure 24. Thermal Pad Dimensions