ZHCSGE0B June   2017  – January 2019 TPS53681

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1. 3.1 简化应用
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Supply: Currents, UVLO, and Power-On Reset
    6. 6.6  References: DAC and VREF
    7. 6.7  Voltage Sense: AVSP and BVSP, AVSN and BVSN
    8. 6.8  Telemetry
    9. 6.9  Input Current Sensing
    10. 6.10 Programmable Loadline Settings
    11. 6.11 Current Sense and Calibration
    12. 6.12 Logic Interface Pins: AVR_EN, AVR_RDY, BVR_EN, BVR_RDY, RESET, VR_FAULT, VR_HOT
    13. 6.13 I/O Timing
    14. 6.14 PMBus Address Setting
    15. 6.15 Overcurrent Limit Thresholds
    16. 6.16 Switching Frequency
    17. 6.17 Slew Rate Settings
    18. 6.18 Ramp Selections
    19. 6.19 Dynamic Integration and Undershoot Reduction
    20. 6.20 Boot Voltage and TMAX Settings
    21. 6.21 Protections: OVP and UVP
    22. 6.22 Protections: ATSEN and BTSEN Pin Voltage Levels and Fault
    23. 6.23 PWM: I/O Voltage and Current
    24. 6.24 Dynamic Phase Add and Drop
    25. 6.25 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Phase Interleaving and PWM Operation
        1. 7.3.1.1 Setting the Load-Line (DROOP)
        2. 7.3.1.2 Load Transitions
          1. 7.3.1.2.1 VID Table
        3. 7.3.1.3 Temperature and Fault Sensing
        4. 7.3.1.4 AutoBalance™ Current Sharing
        5. 7.3.1.5 Phase Configuration for Channel B
        6. 7.3.1.6 RESET Function
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1  PMBus Connections
      2. 7.5.2  PMBus Address Selection
      3. 7.5.3  Supported Commands
      4. 7.5.4  Commonly Used PMBus Commands
      5. 7.5.5  Voltage, Current, Power, and Temperature Readings
        1. 7.5.5.1 (88h) READ_VIN
          1. Table 6. READ_VIN Register Field Descriptions
        2. 7.5.5.2 (89h) READ_IIN
          1. Table 7. READ_IIN Register Field Descriptions
        3. 7.5.5.3 (8Bh) READ_VOUT
          1. Table 8. READ_VOUT Register Field Descriptions
        4. 7.5.5.4 (8Ch) READ_IOUT
          1. Table 9. READ_IOUT Register Field Descriptions
        5. 7.5.5.5 (8Dh) READ_TEMPERATURE_1
          1. Table 10. READ_TEMPERATURE_1 Register Field Descriptions
        6. 7.5.5.6 (96h) READ_POUT
          1. Table 11. READ_POUT Register Field Descriptions
        7. 7.5.5.7 (97h) READ_PIN
          1. Table 12. READ_PIN Register Field Descriptions
        8. 7.5.5.8 (D4h) MFR_SPECIFIC_04
          1. Table 13. MFR_SPECIFIC_04 Register Field Descriptions
      6. 7.5.6  Input Current Sense and Calibration
        1. 7.5.6.1 Measured Input Current Calibration
        2. 7.5.6.2 (DAh) MFR_SPECIFIC_10
          1. Table 15. MFR_SPECIFIC_10 Register Field Descriptions
        3. 7.5.6.3 (DCh) MFR_SPECIFIC_12
          1. Table 17. MFR_SPECIFIC_12 Register Field Descriptions
      7. 7.5.7  Output Current Sense and Calibration
        1. 7.5.7.1 Reading Individual Phase Currents
          1. 7.5.7.1.1 Reading Total Current
          2. 7.5.7.1.2 Calibrating Current Measurements
        2. 7.5.7.2 (38h) IOUT_CAL_GAIN
          1. Table 20. IOUT_CAL_GAIN Register Field Descriptions
        3. 7.5.7.3 (39h) IOUT_CAL_OFFSET
          1. Table 22. IOUT_CAL_OFFSET Register Field Descriptions
      8. 7.5.8  Output Voltage Margin Testing
        1. 7.5.8.1 (01h) OPERATION
          1. Table 25. OPERATION Register Field Descriptions
        2. 7.5.8.2 (21h) VOUT_COMMAND
          1. Table 26. VOUT_COMMAND Register Field Descriptions
        3. 7.5.8.3 (26h) VOUT_MARGIN_LOW
          1. Table 27. VOUT_MARGIN_LOW Register Field Descriptions
        4. 7.5.8.4 (25h) VOUT_MARGIN_HIGH
          1. Table 28. VOUT_MARGIN_HIGH Register Field Descriptions
      9. 7.5.9  Loop Compensation
        1. 7.5.9.1 (D7h) MFR_SPECIFIC_07
          1. Table 29. MFR_SPECIFIC_07 Register Field Descriptions
        2. 7.5.9.2 (28h) VOUT_DROOP
          1. Table 34. VOUT_DROOP Register Field Descriptions
      10. 7.5.10 Converter Protection and Response
      11. 7.5.11 Output Overvoltage Protection and Response
        1. 7.5.11.1 (40h) VOUT_OV_FAULT_LIMIT
          1. Table 37. VOUT_OV_FAULT_LIMIT Register Field Descriptions
        2. 7.5.11.2 (41h) VOUT_OV_FAULT_RESPONSE
          1. Table 38. VOUT_OV_FAULT_RESPONSE Register Field Descriptions
      12. 7.5.12 Maximum Allowed Output Voltage Setting
        1. 7.5.12.1 (24h) VOUT_MAX
          1. Table 39. VOUT_MAX Register Field Descriptions
      13. 7.5.13 Output Undervoltage Protection and Response
        1. 7.5.13.1 (44h) VOUT_UV_FAULT_LIMIT
          1. Table 40. VOUT_UV_FAULT_LIMIT Register Field Descriptions
        2. 7.5.13.2 (45h) VOUT_UV_FAULT_RESPONSE
          1. Table 41. VOUT_UV_FAULT_RESPONSE Register Field Descriptions
      14. 7.5.14 Minimum Allowed Output Voltage Setting
        1. 7.5.14.1 (2Bh) VOUT_MIN
          1. Table 42. VOUT_MIN Register Field Descriptions
      15. 7.5.15 Output Overcurrent Protection and Response
        1. 7.5.15.1 (46h) IOUT_OC_FAULT_LIMIT
          1. Table 43. IOUT_OC_FAULT_LIMIT Register Field Descriptions
        2. 7.5.15.2 (4Ah) IOUT_OC_WARN_LIMIT
          1. Table 44. IOUT_OC_WARN_LIMIT Register Field Descriptions
        3. 7.5.15.3 (47h) IOUT_OC_FAULT_RESPONSE
          1. Table 45. IOUT_OC_FAULT_RESPONSE Register Field Descriptions
      16. 7.5.16 Input Under-Voltage Lockout (UVLO)
        1. 7.5.16.1 (35h) VIN_ON
          1. Table 46. VIN_ON Register Field Descriptions
      17. 7.5.17 Input Over-Voltage Protection and Response
        1. 7.5.17.1 (55h) VIN_OV_FAULT_LIMIT
          1. Table 48. VIN_OV_FAULT_LIMIT Register Field Descriptions
        2. 7.5.17.2 (56h) VIN_OV_FAULT_RESPONSE
          1. Table 49. VIN_OV_FAULT_RESPONSE Register Field Descriptions
      18. 7.5.18 Input Undervoltage Protection and Response
        1. 7.5.18.1 (59h) VIN_UV_FAULT_LIMIT
          1. Table 50. VIN_UV_FAULT_LIMIT Register Field Descriptions
        2. 7.5.18.2 (5Ah) VIN_UV_FAULT_RESPONSE
          1. Table 52. VIN_UV_FAULT_RESPONSE Register Field Descriptions
      19. 7.5.19 Input Overcurrent Protection and Response
        1. 7.5.19.1 (5Bh) IIN_OC_FAULT_LIMIT
          1. Table 53. IIN_OC_FAULT_LIMIT Register Field Descriptions
        2. 7.5.19.2 (5Dh) IIN_OC_WARN_LIMIT
          1. Table 55. IIN_OC_FAULT_LIMIT Register Field Descriptions
        3. 7.5.19.3 (5Ch) IIN_OC_FAULT_RESPONSE
          1. Table 57. IIN_OC_FAULT_LIMIT Register Field Descriptions
      20. 7.5.20 Over-Temperature Protection and Response
        1. 7.5.20.1 (4Fh) OT_FAULT_LIMIT
          1. Table 58. OT_FAULT_LIMIT Register Field Descriptions
        2. 7.5.20.2 (51h) OT_WARN_LIMIT
          1. Table 59. OT_WARN_LIMIT Register Field Descriptions
        3. 7.5.20.3 (50h) OT_FAULT_RESPONSE
          1. Table 60. OT_FAULT_RESPONSE Register Field Descriptions
      21. 7.5.21 Dynamic Phase Shedding (DPS)
        1. 7.5.21.1 (DEh) MFR_SPECIFIC_14
          1. Table 61. MFR_SPECIFIC_14 Register Field Descriptions
        2. 7.5.21.2 (DFh) MFR_SPECIFIC_15
          1. Table 63. MFR_SPECIFIC_15 Register Field Descriptions
      22. 7.5.22 NVM Programming
      23. 7.5.23 NVM Security
        1. 7.5.23.1 (FAh) MFR_SPECIFIC_42
          1. Table 64. MFR_SPECIFIC_42 Register Field Descriptions
      24. 7.5.24 Black Box Recording
        1. 7.5.24.1 (D8h) MFR_SPECIFIC_08
          1. Table 65. MFR_SPECIFIC_08 Register Field Descriptions
      25. 7.5.25 Board Identification and Inventory Tracking
        1. 7.5.25.1 (9Ah) MFR_MODEL
          1. Table 67. MFR_MODEL Register Field Descriptions
        2. 7.5.25.2 (9Bh) MFR_REVISION
          1. Table 68. MFR_REVISION Register Field Descriptions
        3. 7.5.25.3 (9Dh) MFR_DATE
          1. Table 69. MFR_DATE Register Field Descriptions
      26. 7.5.26 Status Reporting
        1. 7.5.26.1 (78h) STATUS_BYTE
          1. Table 70. STATUS_BYTE Register Field Descriptions
        2. 7.5.26.2 (79h) STATUS_WORD
          1. Table 71. STATUS_WORD Register Field Descriptions
        3. 7.5.26.3 (7Ah) STATUS_VOUT
          1. Table 72. STATUS_VOUT Register Field Descriptions
        4. 7.5.26.4 (7Bh) STATUS_IOUT
          1. Table 73. STATUS_IOUT Register Field Descriptions
        5. 7.5.26.5 (7Ch) STATUS_INPUT
          1. Table 74. STATUS_INPUT Register Field Descriptions
        6. 7.5.26.6 (7Dh) STATUS_TEMPERATURE
          1. Table 75. STATUS_TEMPERATURE Register Field Descriptions
        7. 7.5.26.7 (7Eh) STATUS_CML
          1. Table 76. STATUS_CML Register Field Descriptions
        8. 7.5.26.8 (80h) STATUS_MFR_SPECIFIC
          1. Table 77. STATUS_MFR_SPECIFIC Register Field Descriptions
  8. 8 Applications, Implementation, and Layout
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 6-phase, 0.9-V, 300-A Application and 2-phase 0.8-V, 90-A Application
        1. 8.2.1.1 Schematic
        2. 8.2.1.2 Design Requirements
        3. 8.2.1.3 Detailed Design Procedure
          1. 8.2.1.3.1 Choose Inductor
          2. 8.2.1.3.2 Select the Per-Phase Valley Current Limit
          3. 8.2.1.3.3 Set the Maximum Temperature Level (TMAX)
          4. 8.2.1.3.4 Set USR Thresholds to Improve Load Transient Performance
        4. 8.2.1.4 Inductor DCR and Shunt Current Sensing Design for Input Power
          1. 8.2.1.4.1 Compensation Design
          2. 8.2.1.4.2 Set PMBus Addresses
        5. 8.2.1.5 Application Performance Plots
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Device Guidelines
      2. 10.1.2 Power Stage Guidelines
    2. 10.2 Layout Examples
  11. 11器件和文档支持
    1. 11.1 接收文档更新通知
    2. 11.2 社区资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 术语表
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Pin Configuration and Functions

RSB Package
40-Pin QFN
Top View
TPS53681 pinout_qfn_rsb_40_slusct1.gif
Thermal pad acts as AGND.
NC = not connected

Pin Functions

PIN I/O(1) DESCRIPTION
NAME NO.
ACSP1 23 I Current sense input for the channel A. Connect to the IOUT pin of TI smart power stages. Tie the ACSP5, ACSP4, ACSP3, or ACSP2 pin to the V3P3 pin according to Table 1 to disable the corresponding phase.
ACSP2 24
ACSP3 25
ACSP4 26
ACSP5 27
ACSP6/BCSP3 28 Current sense inputs for channel A or channel B based on NVM option. Connect to the IOUT pin of smart power stages. Tie ACSP6/BCSP3 to the 3.3-V supply to disable corresponding phase.
ADDR 34 I Voltage divider to VREF and GND. The voltage level sets the 7-bit PMBus address with an ADC. Address is latched at 3.3-V power up.
APWM1 8 O PWM signal for phase 1 of channel A.
APWM2 7 O PWM signal for phase 2 of channel A.
APWM3 6 O PWM signal for phase 3 of channel A.
APWM4 5 O PWM signal for phase 4 of channel A.
APWM5 4 O PWM signal for phase 5 of channel A.
APWM6/BPWM3 3 O PWM signal for phase 6 of channel A, or phase 3 of channel B, based on the NVM option.
ATSEN 36 O Connect to TAO pin of TI smart power stages of Channel A to sense the highest temperature of the power stages and to sense the built-in fault signal from power stages
AVR_EN 13 I Active high enable input for channel A. Asserting the AVR_EN pin activates channel A. Re-cycling BVR_EN pin clears the faults of channel A.
AVR_RDY 12 O Power good open-drain output signal of channel A. This open drain output requires an external pull-up resistor. The AVR_RDY pin is pulled low when a shutdown fault occurs.
AVSN 22 I Negative input of the remote voltage sense of channel A.
AVSP 21 I Positive input of the remote voltage sense of channel A.
BCSP1 32 I Current sense input for channel B. Connect to the IOUT pins of TI smart power stages. If channel B is not used, then connect the BCSP1 pin to GND.
BCSP2 29 I Current sense input for channel B. Connect to the IOUT pins of TI smart power stages. Tie the BCSP2 pin to the V3P3 pin according to Table 1 to disable the corresponding phase.
BPWM1 1 O PWM signal for phase 1 of channel B
BPWM2 2 O PWM signal for phase 2 of channel B
BTSEN 35 O Connect to TAO pin of TI smart power stages of Channel B to sense the highest temperature of the power stages and to sense the built-in fault signal from power stages
BVR_EN 20 I Active high enable input for channel B. Asserting the BVR_EN pin activates channel B. Re-cycling BVR_EN pin clears the faults of channel B.
BVR_RDY 16 O Power good open-drain output signal of channel B. This open drain output requires an external pull-up resistor. BVR_RDY is pulled low when a shutdown fault occurs.
BVSN 31 I Negative input of the remote voltage sense of channel B. If channel B is not used, connect BVSN to GND.
BVSP 30 I Positive input of the remote voltage sense of channel B. If channel B is not used, connect BVSP to GND.
CSPIN 37 I Input voltage from the positive terminal connecting to the input current sensing shunt. When input current sensing is not used, short CSPIN to VIN_CSNIN and connect to the converter input voltage (example: 12 V).
GND 17 G Connect to GND
18
NC 19 – No connection.
RESET 15 I/O Resets the output voltage to BOOT voltage
SMB_ALERT 11 I/O SMBus or I2C bi-directional ALERT pin interface. (Open drain)
SMB_CLK 10 I SMBus or I2C serial clock interface. (Open drain)
SMB_DIO 9 I/O SMBus or I2C bi-directional serial data interface. (Open drain)
V3P3 39 P 3.3-V power input. Bypass to GND with a ceramic capacitor with a value greater than or equal to 1 µF. Used to power all digital logic circuits.
VIN_CSNIN 38 P Input voltage sensing for on-time control and telemetry. Serves as the negative terminal connecting to the input current sensing shunt. When input current sensing is not used, short VIN_CSNIN to CSPIN and connect to the converter input voltage (example: 12 V).
VR_FAULT 33 O VR fault indicator. (Open-drain). The failures include the high-side FETs short, over-voltage, over-temperature, and the input over-current conditions. Use the fault signal on the platform to remove the power source by turning off the AC power supply. When the failure occurs, the VR_FAULT pin is LOW, and put the controller into latch-off mode. One NVM bit is used to select whether or not the faults from channel B asserts the VR_FAULT. pin.
VREF 40 O 1.7-V LDO reference voltage. Bypass to GND with 1-µF ceramic capacitor. Connect the VREF pin to the REFIN pin of the TI smart power stages as the current sense common-mode voltage.
VR_HOT 14 O Active low external temperature indicator.
Thermal Pad G Analog ground pad. Connect to GND plan with vias.
(1) G = ground, I = input, O = output, P = power input

Table 1. Current Sense Inputs for Active Phases

Active Phase Channel ACSP1 ACSP2 ACSP3 ACSP4 ACSP5 ACSP6 BSCP1 BSCP2
A B
1 0 AIOUT1 V3P3 n/a n/a n/a n/a GND V3P3
2 1 AIOUT1 AIOUT2 V3P3 n/a n/a n/a BIOUT1 V3P3
3 1 AIOUT1 AIOUT2 AIOUT3 V3P3 n/a n/a BIOUT1 V3P3
4 1 AIOUT1 AIOUT2 AIOUT3 AIOUT4 V3P3 n/a BIOUT1 V3P3
5 1 AIOUT1 AIOUT2 AIOUT3 AIOUT4 AIOUT5 V3P3 BIOUT1 V3P3
6 0 AIOUT1 AIOUT2 AIOUT3 AIOUT4 AIOUT5 AIOUT6 GND V3P3
6(1) 1 AIOUT1 AIOUT2 AIOUT3 AIOUT4 AIOUT5 AIOUT6 BIOUT1 V3P3
6 2 AIOUT1 AIOUT2 AIOUT3 AIOUT4 AIOUT5 AIOUT6 BIOUT1 BIOUT2
5 2 AIOUT1 AIOUT2 AIOUT3 AIOUT4 AIOUT5 V3P3 BIOUT1 BIOUT2
5(1) 3 AIOUT1 AIOUT2 AIOUT3 AIOUT4 AIOUT5 BIOUT3 BIOUT1 BIOUT2
(1) For n+1 or n+3 applications, the NVM setting must be changed. See also the Phase Configuration for Channel B section.