SLUS600E April   2004  – December 2014 TPS51100

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Conditions
    3. 6.3 Thermal Information
    4. 6.4 Electrical Characteristics
    5. 6.5 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 VTT Sink/Source Regulator
      2. 7.3.2 VTTREF Regulator
      3. 7.3.3 Soft-Start
      4. 7.3.4 VTT Current Protection
      5. 7.3.5 VIN UVLO Protection
      6. 7.3.6 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 S5 Control and Soft-Off
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Output Capacitor
        2. 8.2.2.2 Input Capacitor
        3. 8.2.2.3 VIN Capacitor
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DGQ|10
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Input voltage(2) VIN, VLDOIN, VTTSNS, VDDQSNS, S3, S5 –0.3 6 V
PGND –0.3 0.3
Output voltage(2) VTT, VTTREF –0.3 6 V
TA Operating ambient temperature –40 85 °C
Tstg Storage temperature –55 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under RecommendedOperating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to the network ground terminal unless otherwise noted.

6.2 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VIN Supply voltage 4.75 5.25 V
Voltage range S3, S5 –0.10 5.25 V
VLDOIN, VDDQSNS, VTT, VTTSNS –0.1 3.6
VTTREF –0.1 1.8
PGND –0.1 0.1
TA Operating free-air temperature –40 85 °C

6.3 Thermal Information

THERMAL METRIC(1) TPS51100 UNIT
DGQ
10 PINS
RθJA Junction-to-ambient thermal resistance 60.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 63.5
RθJB Junction-to-board thermal resistance 51.6
ψJT Junction-to-top characterization parameter 1.5
ψJB Junction-to-board characterization parameter 22.3
RθJC(bot) Junction-to-case (bottom) thermal resistance 9.5
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.4 Electrical Characteristics

TA = –40°C to 85°C, VVIN = 5 V, VLDOIN and VDDQSNS are connected to 2.5 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY CURRENT
IVIN Supply current, VIN TA = 25°C, VVIN = 5 V, no load, VS3 = VS5 = 5 V 0.25 0.5 1 mA
IVINSTB Standby currrent, VIN TA = 25°C, VVIN = 5 V, no load, VS3 = 0 V, VS5 = 5 V 25 50 80 μA
IVINSDN Shutdown current, VIN TA = 25°C, VVIN = 5 V, no load, VS3 = VS5 = 0 V, VVLDOIN = VVDDQSNS = 0 V 0.3 1 μA
IVLDOIN Supply current, VLDOIN      TA = 25°C, VVIN = 5 V, no load, VS3 = VS5 = 5 V 0.7 1.2 2 mA
IVLDOINSTB Standby currrent, VLDOIN TA = 25°C, VVIN = 5 V, no load,VS3 = 0 V, VS5 = 5 V 6 10 μA
IVLDOINSDN Shutdown current, VLDOIN TA = 25°C, VVIN = 5 V, no load, VS3 = VS5 = 0 V 0.3 1 μA
INPUT CURRENT
IVDDQSNS Input current, VDDQSNS VVIN = 5 V, VS3 = VS5 = 5 V 1 3 5 μA
IVTTSNS Input current, VTTSNS VVIN = 5 V, VS3 = VS5 = 5 V –1 –0.25 1 μA
VTT OUTPUT
VVTTSNS Output voltage, VTT VVLDOIN = VVDDQSNS = 2.5 V 1.25 V
VVLDOIN = VVDDQSNS = 1.8 V 0.9
VVLDOIN = VVDDQSNS = 1.5 V 0.75
VVTTTOL25 Output votlage tolerance to VTTREF, VTT VVLDOIN = VVDDQSNS = 2.5 V, |IVTT| = 0 A –20 20 mV
VVLDOIN = VVDDQSNS = 2.5 V, |IVTT| = 1.5 A –30 30
VVLDOIN = VVDDQSNS = 2.5 V, |IVTT| = 3 A –40 40
VVTTTOL18 VVLDOIN = VVDDQSNS = 1.8 V, |IVTT| = 0 A –20 20
VVLDOIN = VVDDQSNS = 1.8 V, |IVTT| = 1 A –30 30
VVLDOIN = VVDDQSNS = 1.8 V, |IVTT| = 2 A –40 40
VVTTTOL15 VVLDOIN = VVDDQSNS = 1.5 V, |IVTT| = 0 A –20 20
VVLDOIN = VVDDQSNS = 1.5 V, |IVTT| = 1 A –30 30
IVTTOCLSRC Source current limit, VTT il_eq_01_lus600_.gif 3 3.8 6 A
VVTT = 0 V 1.5 2.2 3
IVTTOCLSNK Sink current limit, VTT il_eq_02_lus600_.gif 3 3.6 6 A
VVTT = VVDDQ 1.5 2.2 3
IVTTLK Leakage current, VTT il_eq_03_lus600_.gif –1 0.5 10 μA
VS3 = 0 V, VS5 = 5 V
IVTTSNSLK Leakage current, VTTSNS il_eq_03_lus600_.gif –1 0.01 1 μA
IDSCHRG Discharge current, VTT TA = 25°C,
VVDDQSNS = 0 V,
VS3 = VS5 = 0 V,
VVTT = 0.5 V
10 17 mA
VTTREF OUTPUT
VVTTREF Output voltage, VTTREF il_eq_04_lus600_.gif V
VVTTREFTOL25 Output voltage tolerance to VDDQSNS/2, VTTREF VVLDOIN = VVDDQSNS = 2.5 V, IVTTREF < 10 mA –20 20 mV
VVTTREFTOL18 VVLDOIN = VVDDQSNS = 1.8 V, IVTTREF < 10 mA –17 17
VVTTREFTOL15 VVLDOIN = VVDDQSNS = 1.5 V, IVTTREF < 10 mA –15 15
IVTTREFOCL Source current limit, VTTREF VVTTREF = 0 V 10 20 30 mA
UVLO/LOGIC THRESHOLD
VVINUV UVLO threshold voltage, VIN Wake up 3.4 3.7 4 V
Hysteresis 0.15 0.25 0.35
VIH High-level input voltage S3, S5 1.6 V
VIL Low-level input voltage S3, S5 0.3 V
VIHYST Hysteresis voltage S3, S5 0.2 V
IILEAK Logic input leakage current S2, S5, TA = 25°C –1 1 μA
THERMAL SHUTDOWN
TSDN Thermal shutdown threshold Shutdown temperature 160 °C
Hysteresis 10

6.5 Typical Characteristics

g001_lus600.gifFigure 1. VIN Supply Current vs Temperature
g003_lus600.gifFigure 3. VIN Supply Current vs VTT Load Current
g005_lus600.gifFigure 5. VLDOIN Shutdown Current vs Temperature
g007_lus600.gifFigure 7. VTT Voltage Load Regulation vs VTT Load Current (DDR)
g009_lus600.gifFigure 9. VTT Voltage Load Regulation vs VTT Load Current (DDR3)
g011_lus600.gifFigure 11. VTTREF Voltage Load Regulation vs VTTREF Load Current (DDR2)
g013_lus600.gifFigure 13. VTT Voltage Load Transient Response
g015_lus600.gifFigure 15. Startup Waveforms S3 Low-to-High
g017_lus600.gifFigure 17. Shutdown Waveforms S3 and S5 High-to-Low
g019_lus600.gifFigure 19. Bode Plot DDR Sink
g021_lus600.gifFigure 21. Bode Plot DDR2 Sink
g002_lus600.gifFigure 2. VIN Shutdown Current vs Temperature
g004_lus600.gifFigure 4. VLDOIN Supply Current vs Temperature
g006_lus600.gifFigure 6. Discharge Current vs Temperature
g008_lus600.gifFigure 8. VTT Voltage Load Regulation vs VTT Load Current (DDR2)
g010_lus600.gifFigure 10. VTTREF Voltage Load Regulation vs VTTREF Load Current (DDR)
g012_lus600.gifFigure 12. VTTREF Voltage Load Regulation vs VTTREF Load Current (DDR3)
g014_lus600.gifFigure 14. Startup Waveforms S5 Low-to-High
g016_lus600.gifFigure 16. Shutdown Waveforms S3 High-to-Low
g018_lus600.gifFigure 18. Bode Plot DDR Source
g020_lus600.gifFigure 20. Bode Plot DDR2 Source