To prevent thermal shutdown,
TJ must be less than TABS. If the output current is very
high, the power dissipation can be large. The VQFN package has good thermal
impedance. However, the PCB layout is very important. Good PCB design can optimize
heat transfer, which is absolutely essential for the long-term reliability of the
device.
- Maximize the copper coverage
on the PCB to increase the thermal conductivity of the board. The major
heat-flow path from the package to the ambient is through the copper on the
PCB. Maximum copper is extremely important when there are not any heat sinks
attached to the PCB on the other side of the board opposite the
package.
- Add as many thermal vias as
possible directly under the package ground pad to optimize the thermal
conductivity of the board
- Plate shut or plug and cap
all thermal vias on both sides of the board to prevent solder voids. To
ensure reliability and performance, the solder coverage must be at least
85%.