ZHCSCK2 June   2014

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
  4. 4 简化电路原理图
  5. 5 修订历史记录
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Characteristics
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Parametric Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Enable and Adjusting Undervoltage Lockout
      2. 9.3.2 Overvoltage Protection (OVP)
      3. 9.3.3 Hot Plug-in and In-Rush Current Control
      4. 9.3.4 Overload and Short Circuit Protection :
        1. 9.3.4.1 Overload Protection
        2. 9.3.4.2 Short Circuit Protection
        3. 9.3.4.3 Start-Up with Short on Output
        4. 9.3.4.4 Constant Current Limit Behavior During Overcurrent Faults
      5. 9.3.5 FAULT Response
      6. 9.3.6 Current Monitoring:
      7. 9.3.7 Power Good Comparator
      8. 9.3.8 IN, OUT and GND Pins
      9. 9.3.9 Thermal Shutdown:
    4. 9.4 Device Functional Modes
      1. 9.4.1 DevSleep Mode for SATA® Interface Devices
      2. 9.4.2 Shutdown Control
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 eFuse for Enterprise SSDs
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Step by Step Design Procedure
          2. 10.2.1.2.2 Programming the Current-Limit Threshold: R(ILIM) Selection
          3. 10.2.1.2.3 Undervoltage Lockout and Overvoltage Set Point
          4. 10.2.1.2.4 Programming Current Monitoring Resistor - RIMON
          5. 10.2.1.2.5 Setting Output Voltage Ramp time (tdVdT)
            1. 10.2.1.2.5.1 Case1: Start-up Without Load: Only Output Capacitance C(OUT) Draws Current During Start-up
            2. 10.2.1.2.5.2 Case 2: Start-up With Load: Output Capacitance C(OUT) and Load Draws Current During Start-up
          6. 10.2.1.2.6 Programing the Power Good Set Point
          7. 10.2.1.2.7 Support Component Selections - R6, R7 and CIN
        3. 10.2.1.3 Application Curves
    3. 10.3 System Examples
      1. 10.3.1 Power Failure Protection and Data Retention in SSDs
      2. 10.3.2 Boost Power Rail Configuration for Data Retention in Enterprise SSDs
  11. 11Power Supply Recommendations
    1. 11.1 Transient Protection
    2. 11.2 Output Short-Circuit Measurements
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 相关链接
    2. 13.2 Trademarks
    3. 13.3 Electrostatic Discharge Caution
    4. 13.4 Glossary
  14. 14机械封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RVC|20
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Pin Configuration and Functions

TPS25940
RVC PACKAGE
(TOP VIEW)
po_slvscf3.gif

Pin Functions

NAME NO. I/O DESCRIPTION
DEVSLP 1 I Active High. DevSleep Mode control. A high at this pin will activate the DevSleep mode(Low Power Mode).
PGOOD 2 O Active High. A high indicates PGTH has crossed the threshold value. It is an open drain output.
PGTH 3 I Positive input of PGOOD comparator.
OUT 4 - 8 O Power Output of the device.
IN 9 - 13 I Power Input and supply voltage of the device.
EN/UVLO 14 I Input for setting programmable undervoltage lockout threshold. An undervoltage event will open internal FET and assert FLT to indicate power-failure. When pulled to GND, resets the fault latch in TPS25940L.
OVP 15 I Input for setting programmable overvoltage protection threshold. An overvoltage event will open the internal FET and assert FLT to indicate overvoltage.
GND 16 — Ground.
ILIM 17 I/O A resistor from this pin to GND sets the overload and short-circuit current limit.
dVdT 18 I/O A capacitor from this pin to GND sets the ramp rate of output voltage.
IMON 19 O This pin sources a scaled down ratio of current through the internal FET. A resistor from this pin to GND converts current to proportional voltage, used as analog current monitor.
FLT 20 O Fault event indicator, goes low to indicate fault condition due to Undervoltage, Overvoltage, Reverse voltage and Thermal shutdown event. It is an open drain output.
PowerPADTM The GND terminal must be connected to the exposed PowerPAD. This PowerPAD must be connected to a PCB ground plane using multiple vias for good thermal performance.