ZHCSMS4B
November 2020 – September 2021
TPS25864-Q1
,
TPS25865-Q1
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
说明(续)
6
Device Comparison Table
7
Pin Configuration and Functions
8
Specifications
8.1
Absolute Maximum Ratings
8.2
ESD Ratings
8.3
Recommended Operating Conditions
8.4
Thermal Information
8.5
Electrical Characteristics
8.6
Timing Requirements
8.7
Switching Characteristics
8.8
Typical Characteristics
9
Parameter Measurement Information
10
Detailed Description
10.1
Overview
10.2
Functional Block Diagram
10.3
Feature Description
10.3.1
Power-Down or Undervoltage Lockout
10.3.2
Input Overvoltage Protection (OVP) - Continuously Monitored
10.3.3
Buck Converter
10.3.4
FREQ/SYNC
10.3.5
Bootstrap Voltage (BOOT)
10.3.6
Minimum ON-Time, Minimum OFF-Time
10.3.7
Internal Compensation
10.3.8
Selectable Output Voltage (VSET)
10.3.9
Current Limit and Short Circuit Protection
10.3.9.1
USB Switch Current Limit
10.3.9.2
Interlocking for Two-Level USB Switch Current Limit
10.3.9.3
Cycle-by-Cycle Buck Current Limit
10.3.9.4
OUT Current Limit
10.3.10
Cable Compensation
10.3.11
Thermal Management With Temperature Sensing (TS) and OTSD
10.3.12
Thermal Shutdown
10.3.13
USB Specification Overview
10.3.14
USB Port Operating Modes
10.3.14.1
Dedicated Charging Port (DCP) Mode
10.3.14.1.1
DCP BC1.2 and YD/T 1591-2009
10.3.14.1.2
DCP Divider-Charging Scheme
10.3.14.1.3
DCP 1.2-V Charging Scheme
10.3.14.2
DCP Auto Mode
10.4
Device Functional Modes
10.4.1
Shutdown Mode
10.4.2
Active Mode
11
Application and Implementation
11.1
Application Information
11.2
Typical Applications
11.2.1
Design Requirements
11.2.2
Detailed Design Procedure
11.2.2.1
Output Voltage Setting
11.2.2.2
Switching Frequency
11.2.2.3
Inductor Selection
11.2.2.4
Output Capacitor Selection
11.2.2.5
Input Capacitor Selection
11.2.2.6
Bootstrap Capacitor Selection
11.2.2.7
Undervoltage Lockout Set-Point
11.2.2.8
Cable Compensation Set-Point
11.2.3
Application Curves
12
Power Supply Recommendations
13
Layout
13.1
Layout Guidelines
13.2
Layout Example
13.3
Ground Plane and Thermal Considerations
14
Device and Documentation Support
14.1
接收文档更新通知
14.2
支持资源
14.3
Trademarks
14.4
Electrostatic Discharge Caution
14.5
术语表
15
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
RPQ|25
MPQF555A
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsms4b_oa
zhcsms4b_pm
14.5
术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。