ZHCSLT5C December   2009  – October 2020 TPS2560 , TPS2561

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 ESD Ratings: Surge
    4. 7.4 Recommended Operating Conditions
    5. 7.5 Thermal Information
    6. 7.6 Electrical Characteristics
    7. 7.7 Dissipation Ratings
    8. 7.8 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Overcurrent Conditions
      2. 9.3.2 FAULTx Response
      3. 9.3.3 Undervoltage Lockout (UVLO)
      4. 9.3.4 Enable ( ENx or ENx)
      5. 9.3.5 Thermal Sense
    4. 9.4 Device Functional Modes
  10. 10Power Supply Recommendations
    1. 10.1 Self-Powered and Bus-Powered Hubs
    2. 10.2 Low-Power Bus-Powered and High-Power Bus-Powered Functions
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Power Dissipation
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 接收文档更新通知
    2. 12.2 支持资源
    3. 12.3 Trademarks
    4. 12.4 静电放电警告
    5. 12.5 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.5 Thermal Information

THERMAL METRIC(1)TPS256xUNIT
DRC (VSON)
10 PINS
RθJAJunction-to-ambient thermal resistance47.8°C/W
RθJC(top)Junction-to-case (top) thermal resistance66.2°C/W
RθJBJunction-to-board thermal resistance22.4°C/W
ψJTJunction-to-top characterization parameter1.6°C/W
ψJBJunction-to-board characterization parameter22.6°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance4.9°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.