ZHCSBZ2B December   2013  – March 2020 TPS22966-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      典型应用原理图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: VBIAS = 5 V
    6. 6.6 Electrical Characteristics: VBIAS = 2.5 V
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
      1. 6.8.1 Typical AC Scope Captures at TA = 25ºC, CT = 1 nF
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Quick Output Discharge
      2. 8.3.2 ON/OFF Control
      3. 8.3.3 Adjustable Rise Time
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Input Capacitor (Optional)
      2. 9.1.2 Output Capacitor (Optional)
      3. 9.1.3 VIN and VBIAS Voltage Range
      4. 9.1.4 Safe Operating Area (SOA)
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 商标
    2. 12.2 静电放电警告
    3. 12.3 Glossary
    4. 12.4 接收文档更新通知
    5. 12.5 支持资源
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Pin Configuration and Functions

DPU Package
14-Pin WSON
TPS22966-Q1 pinout_lvsbh4.gif

Pin Functions

PIN I/O DESCRIPTION
NO. NAME
1 VIN1 I Switch 1 input. Place an optional decoupling capacitor between this pin and GND for reduce VIN dip during turnon of the channel. See Application Information section for more information.
2 VIN1 I Switch 1 input. Place an optional decoupling capacitor between this pin and GND for reduce VIN dip during turnon of the channel. See Application Informationfor more information.
3 ON1 I Active high switch 1 control input. Do not leave floating.
4 VBIAS I Bias voltage. Power supply to the device. See Application Information for more information.
5 ON2 I Active high switch 2 control input. Do not leave floating.
6 VIN2 I Switch 2 input. Place an optional decoupling capacitor between this pin and GND for reduce VIN dip during turnon of the channel. See Application Information for more information.
7 VIN2 I Switch 2 input. Place an optional decoupling capacitor between this pin and GND for reduce VIN dip during turnon of the channel. See Application Information for more information.
8 VOUT2 O Switch 2 output.
9 VOUT2 O Switch 2 output.
10 CT2 O Switch 2 slew rate control. Can be left floating. Capacitor used on this pin should be rated for a minimum of 25 V for desired rise time performance.
11 GND – Ground
12 CT1 O Switch 1 slew rate control. Can be left floating. Capacitor used on this pin should be rated for a minimum of 25 V for desired rise time performance.
13 VOUT1 O Switch 1 output.
14 VOUT1 O Switch 1 output.
15 Thermal Pad O Thermal pad (exposed center pad) to alleviate thermal stress. Tie to GND. See Layout Guidelines for layout guidelines.