ZHCS483A October   2011  – December 2014 TPIC74101-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Dissipation Rating
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Switch-Mode Input/Output Pins (L1, L2)
      2. 7.3.2  Supply Pin (Vdriver)
      3. 7.3.3  Internal Supply Decoupling Pin (Vlogic)
      4. 7.3.4  Input Voltage Monitoring Pin (AIN)
      5. 7.3.5  Input Undervoltage Alarm Pin (AOUT)
      6. 7.3.6  Reset Delay Timer Pin (REST)
      7. 7.3.7  Reset Pin (RESET)
      8. 7.3.8  Main Regulator Output Pin (VOUT)
      9. 7.3.9  Low-Power-Mode Pin (CLP)
      10. 7.3.10 Switch-Output Pin (5Vg)
      11. 7.3.11 5Vg-Enable Pin (5Vg_ENABLE)
      12. 7.3.12 Slew-Rate Control Pins (SCR0, SCR1)
      13. 7.3.13 Modulator Frequency Setting (Pin Rmod)
      14. 7.3.14 Ground Pin (PGND)
      15. 7.3.15 Enable Pin (ENABLE)
      16. 7.3.16 Bootstrap Pins (Cboot1 and Cboot2)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Clock Modulator
      2. 7.4.2 Buck/Boost Transitioning
      3. 7.4.3 Buck SMPS
      4. 7.4.4 Boost SMPS
      5. 7.4.5 Extension of the Input Voltage Range on V(driver)
      6. 7.4.6 Low-Power Mode
      7. 7.4.7 Temperature and Short-Circuit Protection
      8. 7.4.8 Switch Output Pin (5Vg) Current Limitation
      9. 7.4.9 Soft Start
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Buck Mode
        2. 8.2.2.2 Boost Mode
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Switch-Mode Power Supply
        1. 10.1.1.1 Inductor
        2. 10.1.1.2 Filter Capacitors
        3. 10.1.1.3 Traces and Ground Plane
      2. 10.1.2 Package and PCB Land Configuration for a Multilayer PCB
      3. 10.1.3 Multilayer (Side View)
      4. 10.1.4 Single-Layer
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 商标
    2. 11.2 静电放电警告
    3. 11.3 术语表
  12. 12机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 器件和文档支持

11.1 商标

PowerPAD is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.2 静电放电警告

esds-image

这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损伤。

11.3 术语表

SLYZ022 — TI 术语表。

这份术语表列出并解释术语、首字母缩略词和定义。