ZHCSJA2A
January 2019 – March 2019
TPA3255-Q1
PRODUCTION DATA.
1
特性
2
应用
3
说明
Device Images
简化原理图
总谐波失真
4
修订历史记录
5
Pin Configuration and Functions
Pin Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Audio Characteristics (BTL)
6.7
Audio Characteristics (SE)
6.8
Audio Characteristics (PBTL)
6.9
Typical Characteristics, BTL Configuration
6.10
Typical Characteristics, SE Configuration
6.11
Typical Characteristics, PBTL Configuration
7
Parameter Measurement Information
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagrams
8.3
Feature Description
8.3.1
Error Reporting
8.4
Device Functional Modes
8.4.1
Device Protection System
8.4.1.1
Overload and Short Circuit Current Protection
8.4.1.2
Signal Clipping and Pulse Injector
8.4.1.3
DC Speaker Protection
8.4.1.4
Pin-to-Pin Short Circuit Protection (PPSC)
8.4.1.5
Overtemperature Protection OTW and OTE
8.4.1.6
Undervoltage Protection (UVP) and Power-on Reset (POR)
8.4.1.7
Fault Handling
8.4.1.8
Device Reset
9
Application and Implementation
9.1
Application Information
9.2
Typical Applications
9.2.1
Stereo BTL Application
9.2.1.1
Design Requirements
9.2.1.2
Detailed Design Procedures
9.2.1.2.1
Decoupling Capacitor Recommendations
9.2.1.2.2
PVDD Capacitor Recommendation
9.2.1.2.3
PCB Material Recommendation
9.2.1.2.4
Oscillator
9.2.2
Application Curves
9.2.3
Typical Application, Single Ended (1N) SE
9.2.3.1
Design Requirements
9.2.3.2
Detailed Design Procedures
9.2.3.3
Application Curves
9.2.4
Typical Application, Differential (2N) PBTL
9.2.4.1
Design Requirements
9.2.4.2
Detailed Design Procedures
9.2.4.3
Application Curves
10
Power Supply Recommendations
10.1
Power Supplies
10.1.1
VDD Supply
10.1.2
GVDD_X Supply
10.1.3
PVDD Supply
10.2
Powering Up
10.3
Powering Down
10.4
Thermal Design
10.4.1
Thermal Performance
10.4.2
Thermal Performance with Continuous Output Power
10.4.3
Thermal Performance with Non-Continuous Output Power
11
Layout
11.1
Layout Guidelines
11.2
Layout Examples
11.2.1
BTL Application Printed Circuit Board Layout Example
11.2.2
SE Application Printed Circuit Board Layout Example
11.2.3
PBTL Application Printed Circuit Board Layout Example
12
器件和文档支持
12.1
文档支持
12.2
接收文档更新通知
12.3
社区资源
12.4
商标
12.5
静电放电警告
12.6
术语表
13
机械、封装和可订购信息
封装选项
机械数据 (封装 | 引脚)
DDV|44
MPDS169G
散热焊盘机械数据 (封装 | 引脚)
DDV|44
PPTD233A
订购信息
zhcsja2a_oa
zhcsja2a_pm
11
Layout