ZHCS246E May   2011  – April 2015 TMP006

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
  4. 修订历史记录
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Spectral Responsivity
      2. 8.3.2 Field of View and Angular Response
      3. 8.3.3 Thermopile Principles and Operation
      4. 8.3.4 Object Temperature Calculation
      5. 8.3.5 Calibration
      6. 8.3.6 Sensor Voltage Format
      7. 8.3.7 Temperature Format
      8. 8.3.8 Serial Interface
        1. 8.3.8.1 Serial Bus Address
        2. 8.3.8.2 Read and Write Operations
        3. 8.3.8.3 Two-Wire Timing Diagrams
    4. 8.4 Device Functional Modes
    5. 8.5 Register Maps
      1. 8.5.1 Sensor Voltage Result (VSENSOR) Register (address = 00h) [reset = 0000000000000000]
      2. 8.5.2 Temperature (TDIE) Register (address = 01h) [reset = 0000000000000000]
      3. 8.5.3 Configuration Register (address = 02h) [reset = 0111010000000000]
      4. 8.5.4 Manufacturer and Device ID Registers
        1. 8.5.4.1 Manufacturer ID Register (address = FEh) [reset = 0101010001001001]
        2. 8.5.4.2 Device ID Register (address = FFh) [reset = 0000000001100111]
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Wide-Range Calibration Example: TOBJ = 0°C to 60°C, Common vs Unit Calibration
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Wide-Range Calibration
          2. 9.2.1.2.2 Verifying the Calibration
        3. 9.2.1.3 Application Curves
    3. 9.3 System Examples
      1. 9.3.1 Use of NEP, NETD, and Responsivity in Estimating System Performance
  10. 10Power-Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 器件命名规则
    2. 12.2 文档支持
      1. 12.2.1 相关文档
    3. 12.3 相关链接
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 术语表
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

修订历史记录

Changes from D Revision (November 2014) to E Revision

  • 已更改特性应用说明部分Go
  • 已更改简化电路原理图中的热电堆传感器部分Go
  • Changed operating range minimum value in Absolute Maximum Ratings from –55°C to –40°CGo
  • Changed Handling Ratings to ESD Ratings and moved storage temperature to Absolute Maximum RatingsGo
  • Changed Figure 3 Go
  • Changed thermopile sensor portion of functional block diagramGo
  • Deleted text at the end of 2nd paragraph in Field of View and Angular Response section Go
  • Added Figure 8Go
  • Changed TREG to TDIE in Temperature Format section Go

Changes from C Revision (December 2012) to D Revision

  • 已将整篇数据表中的所有 WCSP 更改为 DSBGAGo
  • 已更改文档格式以符合最新数据表标准Go
  • 已添加器件比较处理额定值建议运行条件表,特性描述器件功能模式寄存器映射应用和实施电源相关建议布局器件和文档支持以及机械、封装和可订购信息部分Go
  • 已更改说明部分第一段中的文本Go
  • 已将整篇数据表中的所有“本地温度”更改为“芯片温度”Go
  • 已将首页上的柱状图移至典型特性部分Go
  • 已添加简化电路原理图标题至首页图片Go
  • 已更改简化电路原理图Go
  • Deleted Package Information table Go
  • Changed all TObject to TOBJ throughout data sheetGo
  • Changed x- and y-axis labels in Figure 1Go
  • Changed text related to object temperature measurement in first paragraph of Overview sectionGo
  • Changed Table 3Go
  • Changed all VOBJECT to VSENSOR throughout datasheetGo
  • Deleted Pointer Register sectionGo
  • Changed Sensor Voltage Register name to Sensor Voltage Result Register Go
  • Changed TAMBIENT to TDIE throughout data sheet Go

Changes from B Revision (February 2012) to C Revision

  • 已添加 TMP006B 器件至数据表Go
  • Changed Package Information table to include new TMP006B device with the TMP006, and show the different voltage for the two devicesGo

Changes from A Revision (July 2011) to B Revision

  • Changed Output Error, Calculate object temperature parameter test conditions in Electrical Characteristics tableGo
  • Changed description of device ID to 0067h in Manufacturer and Device ID Registers sectionGo
  • Changed FFh, Reset value bits D2, D1, and D0 values in Figure 18Go
  • Changed Figure 23 Go
  • Changed Figure 24Go
  • Changed Figure 25Go

Changes from * Revision (May, 2011) to A Revision

  • Added specifications for ambient temperature sensor parameter over 0°C to +60°CGo
  • Revised Table 4Go