SLVSFF4 December   2019 TLVH431B-EP

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Simplified Schematic
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 Open Loop (Comparator)
      2. 8.4.2 Closed Loop
  9. Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Comparator With Integrated Reference (Open Loop)
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Basic Operation
          2. 9.2.1.2.2 Overdrive
          3. 9.2.1.2.3 Output Voltage and Logic Input Level
            1. 9.2.1.2.3.1 Input Resistance
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Shunt Regulator/Reference
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Programming Output/Cathode Voltage
          2. 9.2.2.2.2 Total Accuracy
          3. 9.2.2.2.3 Stability
        3. 9.2.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Thermal Information

THERMAL METRIC(1) TLVH431B-EP UNIT
DBZ (SOT-23)
3 PINS
RθJA Junction-to-ambient thermal resistance 226.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 91.5 °C/W
RθJB Junction-to-board thermal resistance 45.0 °C/W
ψJT Junction-to-top characterization parameter 3.0 °C/W
ψJB Junction-to-board characterization parameter 44.7 °C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.