ZHCSUZ6B February 2024 – May 2024
PRODMIX
请参考 PDF 数据表获取器件具体的封装图。
THERMAL METRIC(1) | TLV9054-Q1 | UNIT | ||
---|---|---|---|---|
D (SOIC) |
PW (TSSOP) |
|||
14 PINS | 14 PINS | |||
RθJA | Junction-to-ambient thermal resistance | TBD | TBD | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | TBD | TBD | °C/W |
RθJB | Junction-to-board thermal resistance | TBD | TBD | °C/W |
ψJT | Junction-to-top characterization parameter | TBD | TBD | °C/W |
ψJB | Junction-to-board characterization parameter | TBD | TBD | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | °C/W |