SLOS081M February 1977 – December 2021 TL081 , TL081A , TL081B , TL081H , TL082 , TL082A , TL082B , TL082H , TL084 , TL084A , TL084B , TL084H
PRODUCTION DATA
请参考 PDF 数据表获取器件具体的封装图。
THERMAL METRIC (1) | TL084H | UNIT | |||
---|---|---|---|---|---|
D (SOIC) |
DYY (2)
(SOT-23) |
PW (TSSOP) |
|||
14 PINS | 14 PINS | 14 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 114.2 | TBD | 134.4 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 70.3 | TBD | 62.6 | °C/W |
RθJB | Junction-to-board thermal resistance | 70.2 | TBD | 77.6 | °C/W |
ψJT | Junction-to-top characterization parameter | 28.8 | TBD | 13.0 | °C/W |
ψJB | Junction-to-board characterization parameter | 69.8 | TBD | 77.0 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | TBD | N/A | °C/W |