ZHCSI82E May   2018  – May 2019 THVD1410 , THVD1450 , THVD1451 , THVD1452

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      THVD1410 和 THVD1450 简化原理图
      2.      THVD1451 简化原理图
      3.      THVD1452 简化原理图
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
    2.     Pin Functions
    3.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  ESD Ratings [IEC]
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Thermal Information
    6. 7.6  Power Dissipation
    7. 7.7  Electrical Characteristics
    8. 7.8  Switching Characteristics
    9. 7.9  Typical Characteristics: All Devices
    10. 7.10 Typical Characteristics: THD1450, THVD1451 and THVD1452
    11. 7.11 Typical Characteristics: THVD1410
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagrams
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device Functional Modes for THVD1410 and THVD1450
      2. 9.4.2 Device Functional Modes for THVD1451
      3. 9.4.3 Device Functional Modes for THVD1452
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Data Rate and Bus Length
        2. 10.2.1.2 Stub Length
        3. 10.2.1.3 Bus Loading
        4. 10.2.1.4 Receiver Failsafe
        5. 10.2.1.5 Transient Protection
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 器件支持
    2. 13.2 第三方产品免责声明
    3. 13.3 相关链接
    4. 13.4 接收文档更新通知
    5. 13.5 社区资源
    6. 13.6 商标
    7. 13.7 静电放电警告
    8. 13.8 Glossary
  14. 14机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • D|8
  • DRB|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from D Revision (March 2019) to E Revision

  • 将 THVD1451 从产品预览 更改为生产 数据Go

Changes from C Revision (February 2019) to D Revision

  • 将 THVD1410 从产品预览 更改为生产数据Go

Changes from B Revision (December 2018) to C Revision

  • 将 THVD1452 从产品预览 更改为生产 数据Go

Changes from A Revision (May 2018) to B Revision

  • 添加特性：“差分输出超过 2.1 V...”Go
  • 更改特性：将“±18kV IEC 61000-4-2 气隙放电”更改为：“±25kV IEC 61000-4-2 气隙放电”Go
  • 添加 THVD1451 的 SOIC (8) 封装Go
  • Added Thermal Pad to the THVD1450 DRB packageGo
  • Added Thermal Pad to the THVD1451 DRB packageGo
  • Changed all pins HBM ESD rating from 4 kV to 8 kVGo
  • Changed IEC ESD air-gap discharge rating from 18 kV to 25 kVGo
  • Changed THVD1410 power dissipation numbersGo
  • Changed THVD1410 driver tr, tf TYP from 400 ns to 460 ns and MAX from 600 ns to 680 nsGo
  • Changed THVD1410 receiver tr, tf TYP from 13 ns to 10 nsGo
  • Changed THVD1410 receiver tPHL, tPLH TYP from 60 ns to 35 nsGo
  • Added Typical Characteristics, THD1450DGo
  • Added condition to Figure 8 to Figure 3Go
  • Added Typical Characteristics, THD1410Go
  • Changed A to A/Y and B to B/Z in Figure 20 to Figure 24Go
  • Added 3rd paragraph to the Overview sectionGo

Changes from * Revision (November 2017) to A Revision

  • 将文档状态从预告信息 更改为生产数据Go