ZHCSPA5E August   1999  – March 2024 THS4021 , THS4022

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information: THS4021
    5. 5.5 Thermal Information: THS4022
    6. 5.6 Electrical Characteristics: THS4021D and THS4022DGN
    7. 5.7 Electrical Characteristics: THS4021DGN
    8. 5.8 Typical Characteristics: THS4021D and THS4022DGN
    9. 5.9 Typical Characteristics: THS4021DGN
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Offset Nulling
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Driving a Capacitive Load
      2. 7.1.2 General Configuration
    2. 7.2 Power Supply Recommendations
    3. 7.3 Layout
      1. 7.3.1 Layout Guidelines
        1. 7.3.1.1 General PowerPAD™ Integrated Circuit Package Design Considerations
      2. 7.3.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 接收文档更新通知
    3. 8.3 支持资源
    4. 8.4 Trademarks
    5. 8.5 静电放电警告
    6. 8.6 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • D|8
  • DGN|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.2 Power Supply Recommendations

The THS402x devices are designed to operate on power supplies ranging from ±4.5 V to ±16 V (single-ended supplies of 9 V to 32 V). Use a power-supply accuracy of 5% or better. When operated on a board with high-speed digital signals, make sure to provide isolation between digital signal noise and the analog input pins. The THS4021 and THS4022 are connected to the positive power supply (VCC+) through pin 7 and pin 8, respectively. Both devices use pin 4 for the negative power supply (VCC–). Decouple each supply pin to GND as close to the device as possible.