ZHCSAU8F September   2013  – October 2017 TAS5414C-Q1 , TAS5424C-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements for I2C Interface Signals
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Descption
      1. 7.3.1  Preamplifier
      2. 7.3.2  Pulse-Width Modulator (PWM)
      3. 7.3.3  Gate Drive
      4. 7.3.4  Power FETs
      5. 7.3.5  Load Diagnostics
      6. 7.3.6  Protection and Monitoring
      7. 7.3.7  I2C Serial Communication Bus
      8. 7.3.8  I2C Bus Protocol
      9. 7.3.9  Hardware Control Pins
      10. 7.3.10 AM Radio Avoidance
    4. 7.4 Device Functional Modes
      1. 7.4.1 Audio Shutdown and Restart Sequence
      2. 7.4.2 Latched-Fault Shutdown and Restart Sequence Control
    5. 7.5 Programming
      1. 7.5.1 Random Write
      2. 7.5.2 Sequential Write
      3. 7.5.3 Random Read
      4. 7.5.4 Sequential Read
    6. 7.6 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Hardware and Software Design
        2. 8.2.2.2 Parallel Operation (PBTL)
        3. 8.2.2.3 Input Filter Design
        4. 8.2.2.4 Amplifier Output Filtering
        5. 8.2.2.5 Line Driver Applications
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Consideration
    4. 10.4 Electrical Connection of Heat Slug and Heat Sink
    5. 10.5 EMI Considerations
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 相关链接
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 Glossary
  12. 12机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • PHD|64
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from E Revision (January 2015) to F Revision

  • 更改了符合 AEXC-Q100 标准的特性，以包含温度和 ESD 分类Go
  • Changed pin 33 From: CP_BOT To: CPC_BOT in the DKE package image Go
  • Changed pin 40 From: CP_BOT To: CPC_BOT in the PHD package image Go

Changes from D Revision (September 2014) to E Revision

  • Deleted text from step 4 of the Hardware Controls Pins section - "..if, not a quick ramp-down...entering standby." Go
  • Added the Programming section for Read, Write informationGo
  • Added a NOTE to the Applications and Implementation sectionGo
  • Added section title - Typical ApplicationGo
  • Changed Thermal Information To Thermal Consideration and moved the section after Layout ExampleGo

Changes from C Revision (July 2013) to D Revision

  • 增加了“处理额定值”表、特性 说明 部分，器件功能模式，应用和实施部分，电源相关建议部分，布局部分，器件和文档支持部分以及机械、封装和可订购信息部分。Go
  • 已添加器件信息表Go
  • Changed the Human body model (HBM) value From 3000 V To: ±2500 V Go
  • Added the Design Requirements sectionGo
  • Added the Application Curves Go
  • Added the Layout section Go

Changes from B Revision (April 2013) to C Revision

  • 增加了 TAS5424C-Q1 器件至数据表。Go

Changes from A Revision (January 2013) to B Revision

  • 删除了“产品预览”横幅Go

Changes from * Revision (January 2013) to A Revision

  • 删除了 36 引脚 DKD 封装 特性 列表项Go
  • Deleted the 36 Pin DKD packageGo