ZHCSE68A August   2015  – October 2015 TAS5404-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements for I2C Interface Signals
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Descption
      1. 9.3.1  Preamplifier
      2. 9.3.2  Pulse-Width Modulator (PWM)
      3. 9.3.3  Gate Drive
      4. 9.3.4  Power FETs
      5. 9.3.5  Load Diagnostics
      6. 9.3.6  Protection and Monitoring
      7. 9.3.7  I2C Serial Communication Bus
      8. 9.3.8  I2C Bus Protocol
      9. 9.3.9  Hardware Control Pins
      10. 9.3.10 AM Radio Avoidance
    4. 9.4 Device Functional Modes
      1. 9.4.1 Audio Shutdown and Restart Sequence
      2. 9.4.2 Latched-Fault Shutdown and Restart Sequence Control
    5. 9.5 Programming
      1. 9.5.1 Random Write
      2. 9.5.2 Sequential Write
      3. 9.5.3 Random Read
      4. 9.5.4 Sequential Read
    6. 9.6 Register Maps
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Hardware and Software Design
        2. 10.2.2.2 Parallel Operation (PBTL)
        3. 10.2.2.3 Input Filter Design
        4. 10.2.2.4 Amplifier Output Filtering
        5. 10.2.2.5 Line Driver Applications
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Consideration
    4. 12.4 Electrical Connection of Heat Slug and Heat Sink
    5. 12.5 EMI Considerations
  13. 13器件和文档支持
    1. 13.1 器件支持
      1. 13.1.1 Third-Party Products Disclaimer
    2. 13.2 社区资源
    3. 13.3 商标
    4. 13.4 静电放电警告
    5. 13.5 Glossary
  14. 14机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

13 器件和文档支持

13.1 器件支持

13.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

13.2 社区资源

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

13.3 商标

E2E is a trademark of Texas Instruments.

Arctic Silver is a registered trademark of Arctic Silver.

All other trademarks are the property of their respective owners.

13.4 静电放电警告

esds-image

这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损伤。

13.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.