ZHCSGI2B July   2017  – October 2018 TAS2505-Q1

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     简化方框图
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  I2S/LJF/RJF Timing in Master Mode
    7. 6.7  I2S/LJF/RJF Timing in Slave Mode
    8. 6.8  DSP Timing in Master Mode
    9. 6.9  DSP Timing in Slave Mode
    10. 6.10 I2C Interface Timing
    11. 6.11 SPI Interface Timing
    12. 6.12 Typical Characteristics
      1. 6.12.1 Class D Speaker Driver Performance
      2. 6.12.2 HP Driver Performance
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Audio Analog I/O
      2. 8.3.2 Audio DAC and Audio Analog Outputs
      3. 8.3.3 DAC
      4. 8.3.4 POR
      5. 8.3.5 CLOCK Generation and PLL
      6. 8.3.6 Speaker Driver
      7. 8.3.7 Automotive Diagnostics
    4. 8.4 Device Functional Modes
      1. 8.4.1 Digital Pins
      2. 8.4.2 Analog Pins
      3. 8.4.3 Multifunction Pins
      4. 8.4.4 Analog Signals
        1. 8.4.4.1 Analog Inputs AINL and AINR
      5. 8.4.5 DAC Processing Blocks — Overview
      6. 8.4.6 Digital Mixing and Routing
      7. 8.4.7 Analog Audio Routing
      8. 8.4.8 5V LDO
      9. 8.4.9 Digital Audio and Control Interface
        1. 8.4.9.1 Digital Audio Interface
        2. 8.4.9.2 Control Interface
          1. 8.4.9.2.1 I2C Control Mode
          2. 8.4.9.2.2 SPI Digital Interface
        3. 8.4.9.3 Device Special Functions
    5. 8.5 Register Map
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Typical Configuration
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Circuit Configuration With Internal LDO
        1. 9.2.2.1 Design Requirements
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Pad
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档
    2. 12.2 接收文档更新通知
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 术语表
  13. 13机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RGE|24
订购信息

ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) ±2000 V
Charged-device model (CDM), per AEC Q100-011 ±1500
AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.