SCES219V April   1999  – August 2015 SN74LVC1G32

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics, CL = 15 pF
    7. 6.7  Switching Characteristics, 1.8 V and 2.5V
    8. 6.8  Switching Characteristics, 3.3 V and 5 V
    9. 6.9  Operating Characteristics
    10. 6.10 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Community Resources
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
  14. 14Package Option Addendum
    1. 14.1 Packaging Information
    2. 14.2 Tape and Reel Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DPW|5
  • DBV|5
  • DSF|6
  • DCK|5
  • DRL|5
  • YZP|5
  • DRY|6
散热焊盘机械数据 (封装 | 引脚)
订购信息

14 Package Option Addendum

14.1 Packaging Information

Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) Device Marking(4)(5)
SN74LVC1G32DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 85 (C325 ~ C32F ~ C32K ~ C32R) (C32H ~ C32P ~ C32S)
SN74LVC1G32DBVRE4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 C32F
SN74LVC1G32DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 C32F
SN74LVC1G32DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 85 (C325 ~ C32F ~ C32K ~ C32R) (C32H ~ C32P ~ C32S)
SN74LVC1G32DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 C32F
SN74LVC1G32DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 (CG5 ~ CGF ~ CGK ~ CGR) (CGH ~ CGP ~ CGS)
SN74LVC1G32DCKRE4 ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 (CG5 ~ CGF ~ CGK ~ CGR) (CGH ~ CGP ~ CGS)
SN74LVC1G32DCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 (CG5 ~ CGF ~ CGK ~ CGR) (CGH ~ CGP ~ CGS)
SN74LVC1G32DCKT ACTIVE SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 (CG5 ~ CGF ~ CGK ~ CGR) (CGH ~ CGP ~ CGS)
SN74LVC1G32DCKTG4 ACTIVE SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 (CG5 ~ CGF ~ CGK ~ CGR) (CGH ~ CGP ~ CGS)
SN74LVC1G32DPWR ACTIVE X2SON DPW 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 N4
SN74LVC1G32DRLR ACTIVE SOT DRL 5 4000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 (CG7 ~ CGR)
SN74LVC1G32DRLRG4 ACTIVE SOT DRL 5 4000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 (CG7 ~ CGR)
SN74LVC1G32DRY2 ACTIVE SON DRY 6 5000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 CG
SN74LVC1G32DRYR ACTIVE SON DRY 6 5000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 CG
SN74LVC1G32DRYRG4 ACTIVE SON DRY 6 5000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 CG
SN74LVC1G32DSF2 ACTIVE SON DSF 6 5000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 CG
SN74LVC1G32DSFR ACTIVE SON DSF 6 5000 Green (RoHS & no Sb/Br) CU NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 85 CG
SN74LVC1G32YZPR ACTIVE DSBGA YZP 5 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 (CG ~ CG2 ~ CG7)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
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(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
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(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
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(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device
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(5) Multiple Device markings will be inside parentheses. Only on Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

14.2 Tape and Reel Information

SN74LVC1G32 Tape_and_Reel_Dims.gif
Device Package
Type
Package Drawing Pins SPQ Reel
Diameter (mm)
Reel
Width W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
SN74LVC1G32DBVR SOT-23 DBV 5 3000 180.0 8.4 3.23 3.17 1.37 4.0 8.0 Q3
SN74LVC1G32DBVR SOT-23 DBV 5 3000 180.0 9.2 3.17 3.23 1.37 4.0 8.0 Q3
SN74LVC1G32DBVR SOT-23 DBV 5 3000 178.0 9.0 3.3 3.2 1.4 4.0 8.0 Q3
SN74LVC1G32DBVRG4 SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
SN74LVC1G32DBVT SOT-23 DBV 5 250 180.0 9.2 3.17 3.23 1.37 4.0 8.0 Q3
SN74LVC1G32DBVT SOT-23 DBV 5 250 180.0 8.4 3.23 3.17 1.37 4.0 8.0 Q3
SN74LVC1G32DBVT SOT-23 DBV 5 250 178.0 8.4 3.23 3.17 1.37 4.0 8.0 Q3
SN74LVC1G32DBVTG4 SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
SN74LVC1G32DCKR SC70 DCK 5 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3
SN74LVC1G32DCKR SC70 DCK 5 3000 178.0 9.2 2.4 2.4 1.22 4.0 8.0 Q3
SN74LVC1G32DCKR SC70 DCK 5 3000 180.0 9.2 2.3 2.55 1.2 4.0 8.0 Q3
SN74LVC1G32DCKT SC70 DCK 5 250 180.0 9.2 2.3 2.55 1.2 4.0 8.0 Q3
SN74LVC1G32DCKT SC70 DCK 5 250 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3
SN74LVC1G32DCKT SC70 DCK 5 250 178.0 9.2 2.4 2.4 1.22 4.0 8.0 Q3
SN74LVC1G32DPWR X2SON DPW 5 3000 178.0 8.0 0.91 0.91 0.5 2.0 8.0 Q3
SN74LVC1G32DRLR SOT DRL 5 4000 180.0 8.4 1.98 1.78 0.69 4.0 8.0 Q3
SN74LVC1G32DRY2 SON DRY 6 5000 180.0 9.5 1.6 1.15 0.75 4.0 8.0 Q3
SN74LVC1G32DRYR SON DRY 6 5000 180.0 9.5 1.15 1.6 0.75 4.0 8.0 Q1
SN74LVC1G32DSF2 SON DSF 6 5000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q3
SN74LVC1G32DSFR SON DSF 6 5000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2
SN74LVC1G32YZPR DSBGA YZP 5 3000 180.0 8.4 1.02 1.52 0.63 4.0 8.0 Q1
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74LVC1G32DBVR SOT-23 DBV 5 3000 202.0 201.0 28.0
SN74LVC1G32DBVR SOT-23 DBV 5 3000 205.0 200.0 33.0
SN74LVC1G32DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
SN74LVC1G32DBVRG4 SOT-23 DBV 5 3000 180.0 180.0 18.0
SN74LVC1G32DBVT SOT-23 DBV 5 250 205.0 200.0 33.0
SN74LVC1G32DBVT SOT-23 DBV 5 250 202.0 201.0 28.0
SN74LVC1G32DBVT SOT-23 DBV 5 250 180.0 180.0 18.0
SN74LVC1G32DBVTG4 SOT-23 DBV 5 250 180.0 180.0 18.0
SN74LVC1G32DCKR SC70 DCK 5 3000 180.0 180.0 18.0
SN74LVC1G32DCKR SC70 DCK 5 3000 180.0 180.0 18.0
SN74LVC1G32DCKR SC70 DCK 5 3000 205.0 200.0 33.0
SN74LVC1G32DCKT SC70 DCK 5 250 205.0 200.0 33.0
SN74LVC1G32DCKT SC70 DCK 5 250 180.0 180.0 18.0
SN74LVC1G32DCKT SC70 DCK 5 250 180.0 180.0 18.0
SN74LVC1G32DPWR X2SON DPW 5 3000 205.0 200.0 33.0
SN74LVC1G32DRLR SOT DRL 5 4000 202.0 201.0 28.0
SN74LVC1G32DRY2 SON DRY 6 5000 184.0 184.0 19.0
SN74LVC1G32DRYR SON DRY 6 5000 184.0 184.0 19.0
SN74LVC1G32DSF2 SON DSF 6 5000 184.0 184.0 19.0
SN74LVC1G32DSFR SON DSF 6 5000 184.0 184.0 19.0
SN74LVC1G32YZPR DSBGA YZP 5 3000 210.0 185.0 35.0