ZHCSKK0F December   2019  – December 2021 SN74HCS595-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Operating Characteristics
    9.     15
    10. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Functional Block Diagram
    2. 8.2 Feature Description
      1. 8.2.1 Balanced CMOS 3-State Outputs
      2. 8.2.2 Balanced CMOS Push-Pull Outputs
      3. 8.2.3 Latching Logic
      4. 8.2.4 Clamp Diode Structure
      5. 8.2.5 Wettable Flanks
    3. 8.3 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Power Considerations
        2. 9.2.1.2 Input Considerations
        3. 9.2.1.3 Output Considerations
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision E (September 2021) to Revision F (December 2021)

  • 将 WBQB 封装状态从产品预发布 更改为量产 Go

Changes from Revision D (June 2021) to Revision E (September 2021)

  • 添加了 WBQB 封装的功能Go
  • 在器件信息表中添加了 WBQB 器件型号Go
  • Added WBQB package to WQFN pinout diagram and to pin functions tableGo
  • Added WBQB package to Thermal Information table Go

Changes from Revision C (March 2021) to Revision D (June 2021)

  • 将 DYY 封装从产品预发布 更改为量产数据 Go

Changes from Revision B (August 2020) to Revision C (March 2021)

  • 在器件信息 表中添加了 DYY 封装Go
  • Added DYY Package pinout diagram and information to Pin Configuration and Functions.Go
  • Added DYY Package to Thermal Information tableGo

Changes from Revision A (February 2020) to Revision B (August 2020)

  • 更新了整个文档中的表、图和交叉参考的编号格式Go
  • 在可订购产品表中增加了 BQB 封装Go
  • Added BQB Package to Thermal Information tableGo

Changes from Revision * (December 2019) to Revision A (February 2020)

  • 将“应用信息”更改为“量产数据”Go
  • 在可订购产品表中增加了 D 封装Go
  • Added D Package to Thermal Information tableGo