ZHCSPE9G December   1982  – April 2022 SN54HC374 , SN74HC374

PRODUCTION DATA  

  1. 1 特性
  2. 2 说明
  3. 3 Revision History
  4. 4 Pin Configuration and Functions
  5. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions (1)
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics
    5. 5.5 Timing Requirements
    6. 5.6 Switching Characteristics
    7. 5.7 Switching Characteristics
    8. 5.8 Operating Characteristics
  6. 6 Parameter Measurement Information
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Device Functional Modes
  8. 8 Power Supply Recommendations
  9. 9 Layout
    1. 9.1 Layout Guidelines
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 接收文档更新通知
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 术语表
  11. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DB|20
  • NS|20
  • N|20
  • DW|20
  • PW|20
散热焊盘机械数据 (封装 | 引脚)
订购信息

2 说明

这些 8 位触发器具有专门设计用于驱动高电容或相对低阻抗负载的三态输出。它们特别适合用于实现缓冲寄存器、I/O 端口、双向总线驱动器和工作寄存器。

器件信息
器件型号 封装(1) 封装尺寸（标称值）
SN74HC374DW SOIC (20) 12.80mm × 7.50mm
SN74HC374DB SSOP (20) 7.20mm × 5.30mm
SN74HC374N PDIP (20) 25.40mm × 6.35mm
SN74HC374NS SO (20) 15.00 mm × 5.30 mm
SN74HC374PW TSSOP (20) 6.50mm × 4.40mm
SN54HC374J CDIP (20) 26.92mm × 6.92mm
SN54HC374FK LCCC (20) 8.89mm × 8.89mm
SN54HC374W CFP (20) 13.09 mm × 6.92 mm
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附录。
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