ZHCSVI9M May   1996  – April 2024 SN74AHC595

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements: VCC = 3.3 V ± 0.3 V
    7. 5.7  Timing Requirements: VCC = 5 V ± 0.5 V
    8. 5.8  Switching Characteristics: VCC = 3.3 V ± 0.3 V
    9. 5.9  Switching Characteristics: VCC = 5 V ± 0.5 V
    10. 5.10 Operating Characteristics
    11. 5.11 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DB|16
  • PW|16
  • N|16
  • D|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

10 Revision History

Changes from Revision L (March 2024) to Revision M (April 2024)

  • Updated thermal values for PW package from RθJA = 106.1 to 135.9, RθJC(top) = 40.8 to 70.3, RθJB = 51.1 to 81.3, ΨJT = 3.8 to 22.5, ΨJB = 50.6 to 80.8, all values in °C/WGo
  • Added Typical Characteristics Go
  • Updated Layout Example Go

Changes from Revision K (September 2015) to Revision L (March 2024)

  • 删除了对机器型号的引用，将器件信息 更改为封装信息，并在表中添加了封装尺寸Go
  • 向封装信息 表、引脚配置和功能 部分和热性能信息 表中添加了 BQB 封装Go