SLLS301R APRIL   1998  – January 2016 SN65LVDS050 , SN65LVDS051 , SN65LVDS179 , SN65LVDS180

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description (Continued)
  6. Device Options
  7. Pin Configuration and Functions
  8. Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Thermal Information
    5. 8.5  Device Electrical Characteristics
    6. 8.6  Driver Electrical Characteristics
    7. 8.7  Receiver Electrical Characteristics
    8. 8.8  Driver Switching Characteristics
    9. 8.9  Receiver Switching Characteristics
    10. 8.10 Typical Characteristics
  9. Parameter Measurement Information
    1. 9.1 Driver
    2. 9.2 Receiver
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 Driver Offset
      2. 10.3.2 5-V Input Tolerance
      3. 10.3.3 NC Pins
      4. 10.3.4 Driver Equivalent Schematics
      5. 10.3.5 Receiver Features
        1. 10.3.5.1 Receiver Output States
        2. 10.3.5.2 Receiver Open-Circuit Fail-Safe
        3. 10.3.5.3 Receiver Power-On Reset
        4. 10.3.5.4 Common-Mode Range vs Supply Voltage
        5. 10.3.5.5 General Purpose Comparator
        6. 10.3.5.6 Receiver Equivalent Schematics
    4. 10.4 Device Functional Modes
      1. 10.4.1 Function Tables
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
      2. 11.2.2 Detailed Design Procedure
        1. 11.2.2.1 Equipment
        2. 11.2.2.2 Driver Supply Voltage
        3. 11.2.2.3 Driver Bypass Capacitance
        4. 11.2.2.4 Driver Output Voltage
        5. 11.2.2.5 Interconnecting Media
        6. 11.2.2.6 PCB Transmission Lines
        7. 11.2.2.7 Termination Resistor
      3. 11.2.3 Application Curves
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
      1. 13.1.1 Microstrip vs. Stripline Topologies
      2. 13.1.2 Dielectric Type and Board Construction
      3. 13.1.3 Recommended Stack Layout
      4. 13.1.4 Separation Between Traces
      5. 13.1.5 Crosstalk and Ground Bounce Minimization
    2. 13.2 Layout Example
  14. 14Device and Documentation Support
    1. 14.1 Device Support
      1. 14.1.1 Third-Party Products Disclaimer
      2. 14.1.2 Other LVDS Products
    2. 14.2 Documentation Support
      1. 14.2.1 Related Information
    3. 14.3 Related Links
    4. 14.4 Trademarks
    5. 14.5 Electrostatic Discharge Caution
    6. 14.6 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • D|8
  • DGK|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

12 Power Supply Recommendations

The LVDS driver and receivers in this data sheet are designed to operate from a single power supply. Both drivers and receivers operate with supply voltages in the range of 3.0 V to 3.6 V. In a typical application, a driver and a receiver may be on separate boards, or even separate equipment. In these cases, separate supplies would be used at each location. The expected ground potential difference between the driver power supply and the receiver power supply would be less than |±1 V|. Board level and local device level bypass capacitance should be used and are covered in Driver Bypass Capacitance.