ZHCSW12G October   2000  – April 2024 SN65LBC174A , SN75LBC174A

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Dissipation Rating Table
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measure Information
  8. 7 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
  10. 9 Device and Documentation Support
    1. 9.1 接收文档更新通知
    2. 9.2 支持资源
    3. 9.3 Trademarks
    4. 9.4 静电放电警告
    5. 9.5 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • N|16
  • DW|16
  • DW|20
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.2 Dissipation Rating Table

Table 5-1 Dissipation Rating Table
PACKAGE(1) JEDEC BOARD MODEL TA ≤ 25°C
POWER RATING		 DERATING FACTOR (2)
ABOVE TA = 25°C		 TA = 70°C
POWER RATING		 TA = 85°C
POWER RATING
16 DW LOW K 1200 mW 9.6 mW/°C 769 mW 625 mW
HIGH K 2240 mW  17.9 mW/°C 1434 mW 1165 mW
20 DW LOW K 1483 mW 11.86 mW/°C 949 mW 771 mW
HIGH K 2753 mW 22 mW/°C 1762 mW 1432 mW
16 N LOW K 1150 mW 9.2 mW/°C 736 mW 598 mW
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com.
(2) This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow.