ZHCSQ22C July   2009  – June 2022 SN65HVDA195-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 说明（续）
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Local Interconnect Network (LIN) Bus
        1. 9.3.1.1 Transmitter Characteristics
        2. 9.3.1.2 Receiver Characteristics
      2. 9.3.2 Transmit Input (TXD)
      3. 9.3.3 Receive Output (RXD)
        1. 9.3.3.1 RXD Wake-Up Request
      4. 9.3.4 Supply Voltage (VSUP)
      5. 9.3.5 Ground (GND)
      6. 9.3.6 Enable Input (EN)
      7. 9.3.7 NWake Input (NWake)
      8. 9.3.8 Inhibit Output (INH)
    4. 9.4 Device Functional Modes
      1. 9.4.1 Operating Modes
      2. 9.4.2 Normal Mode
      3. 9.4.3 Sleep Mode
      4. 9.4.4 Wake-Up Events
      5. 9.4.5 Standby Mode
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Typical Application
        1. 10.1.1.1 Design Requirements
        2. 10.1.1.2 Detailed Design Procedure
        3. 10.1.1.3 Application Curves
      2.      Power Supply Recommendations
      3. 10.1.2 Layout
        1. 10.1.2.1 Layout Guidelines
        2. 10.1.2.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 接收文档更新通知
    2. 11.2 支持资源
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.4 Thermal Information

THERMAL METRIC(1) D (SOIC) UNIT
8 PINS
RθJA Junction-to-ambient thermal resistance 112.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 66.3 °C/W
RθJB Junction-to-board thermal resistance 52.9 °C/W
ψJT Junction-to-top characterization parameter 19.3 °C/W
ψJB Junction-to-board characterization parameter 52.4 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.