ZHCSCJ8E June   2014  – April 2019 SN65HVD1470 , SN65HVD1471 , SN65HVD1473 , SN65HVD1474 , SN65HVD1476 , SN65HVD1477

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      方框图
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions — SOIC-8 and MSOP-8
    2.     Pin Functions — MSOP–10
    3.     Pin Functions — SOIC-14
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information — D Packages
    5. 7.5  Thermal Information — DGS and DGK Packages
    6. 7.6  Power Dissipation
    7. 7.7  Electrical Characteristics
    8. 7.8  Switching Characteristics — 400 kbps
    9. 7.9  Switching Characteristics — 20 Mbps
    10. 7.10 Switching Characteristics — 50 Mbps
    11. 7.11 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
      1. 9.4.1 Equivalent Circuits
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1.      Master Enable Control
      2.      Slave Enable Control
      3. 10.2.1 Design Requirements
        1. 10.2.1.1 Data Rate and Bus Length
        2. 10.2.1.2 Stub Length
        3. 10.2.1.3 Bus Loading
        4. 10.2.1.4 Receiver Failsafe
        5. 10.2.1.5 Transient Protection
      4. 10.2.2 Detailed Design Procedure
      5. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 器件支持
      1. 13.1.1 第三方产品免责声明
    2. 13.2 相关链接
    3. 13.3 接收文档更新通知
    4. 13.4 社区资源
    5. 13.5 商标
    6. 13.6 静电放电警告
    7. 13.7 术语表
  14. 14机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge IEC 61000-4-2 ESD (Contact Discharge), bus pins and GND ±16000 V
IEC 61000-4-2 ESD (Air-Gap Discharge), bus pins and GND(2)(3) ±16000 V
IEC 61000-4-4 EFT (Fast transient or burst), bus pins and GND ±4000 V
IEC 60749-26 ESD (Human Body Model), bus pins and GND(3) ±30000 V
Human body model (HBM), bus pins and GND(1) ±40000 V
Human body model (HBM), per JEDEC specification JESD22-A114, all pins ±8000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins ±1500 V
Machine model (MM), all pins ±30000 V
(1) Modeled performance only; based on measured IEC ESD (Contact) capability.
(2) By inference from contact-discharge results, see the Application and Implementation section
(3) Limited by tester capability.