ZHCSH34E November   2017  – August 2021 OPA2375 , OPA375

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information for Single Channel
    5. 7.5 Thermal Information for Dual Channel
    6. 7.6 Electrical Characteristics
    7. 7.7 Typical Characteristics: OPA375
    8. 7.8 Typical Characteristics: OPA2375
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 THD + Noise Performance
      2. 8.3.2 Operating Voltage
      3. 8.3.3 Rail-to-Rail Output
      4. 8.3.4 EMI Rejection
      5. 8.3.5 Electrical Overstress
      6. 8.3.6 Typical Specifications and Distributions
      7. 8.3.7 Shutdown Function
      8. 8.3.8 Packages With an Exposed Thermal Pad
      9. 8.3.9 Common Mode Voltage Range
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Single-Supply Electret Microphone Preamplifier With Speech Filter
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision D (February 2021) to Revision E (August 2021)

  • 将 OPA2375 VSSOP (DGK) 封装从预发布 更改为正在供货 Go
  • Removed preview tag for the VSSOP (DGK) package in the Device Comparison Table sectionGo
  • Added VSSOP Package thermal data for OPA2375 in the Thermal Information for Dual Channel sectionGo

Changes from Revision C (June 2020) to Revision D (February 2021)

  • 更新了整个文档中的表格、图和交叉参考的编号格式Go
  • Changed Operating temperature from 125 to 150  in Absolute Maximum Ratings Go
  • Added Junction temperature spec to Absolute Maximum Ratings Go
  • Removed OPA375 Table of Graphs and OPA2375 Table of Graphs tables from the Specifications sectionGo
  • Removed Related Links section from the Device and Documentation Support sectionGo

Changes from Revision B (January 2020) to Revision C (June 2020)

  • 将 OPA2375S X2QFN (RUG) 封装从预发布 更改为正在供货 Go
  • Added X2QFN Package Drawing and Pin Functions for OPA2375S in Pin Configuration and Functions sectionGo
  • Changed typical input current noise density value from 2 fA√HZ to 23 fA√HzGo
  • Changed total supply voltage total from 5V to 5.5V in Electrical Characteristics condition statementGo
  • Deleted "Vs = 2.25 V to 5.5 V" test conditions for common-mode rejection ratio parameter in Electrical Characteristics Go

Changes from Revision A (January 2019) to Revision B (January 2020)

  • 更改了特性 部分的“低宽带噪声”规格以便与 OPA2375 规格匹配Go
  • 向特性 部分添加了 THD+N 规格Go
  • 在特性 部分中添加了 OPA2375 和 OPA4375 的 IQ 定义Go
  • 在特性 部分中添加了 OPA2375 和 OPA4375 的电源电压范围定义Go
  • 将首页上的噪声频谱密度与频率间的关系图更改为 OPA2375 噪声图Go
  • 更改了说明 部分的措辞以反映整个 OPAx375 系列Go
  • 向器件信息 表中添加了 OPA2375 器件Go
  • Added Device Comparison Table sectionGo
  • Added pin out drawings for OPA2375 packages in Pin Configuration and Functions sectionGo
  • Added pin functions for OPA2375 packagesGo
  • Changed  Human-body model (HBM) value from: ±1000 to ±3000 and Charged-device mode (CDM) value from ±250 to ±1000Go
  • Added OPA2375 typical characteristic graphs in the Specifications sectionGo
  • Added EMI Rejection section with description information to Detailed Description sectionGo
  • Added Electrical Overstress section and diagram to Detailed Description sectionGo
  • Added Typical Specification and Distributions section to Detailed Description sectionGo
  • Added Shutdown Function section with description for OPAx375S to Detailed Description sectionGo
  • Added Packages With an Exposed Thermal Pad section to Detailed Description sectionGo
  • Added dual channel layout example in the Layout sectionGo

Changes from Revision * (November 2017) to Revision A (January 2019)

  • Added maximum input offset voltage drift specification in Electrical Characteristics Go