ZHCSGF0D July   2017  – October 2019 MCP6291 , MCP6292 , MCP6294

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      低侧电机控制
      2.      小信号过冲与负载电容间的关系
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions: MCP6921
    2.     Pin Functions: MCP6292
    3.     Pin Functions: MCP6294
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information: MCP6291
    5. 7.5 Thermal Information: MCP6292
    6. 7.6 Thermal Information: MCP6294
    7. 7.7 Electrical Characteristics: VS (Total Supply Voltage) = (V+) – (V–) = 2.4 V to 5.5 V
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Rail-to-Rail Input
      2. 8.3.2 Rail-to-Rail Output
      3. 8.3.3 Overload Recovery
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
    1. 10.1 Input and ESD Protection
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档
    2. 12.2 相关链接
    3. 12.3 接收文档更新通知
    4. 12.4 社区资源
    5. 12.5 商标
    6. 12.6 静电放电警告
    7. 12.7 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from C Revision (January 2019) to D Revision

  • Added 向数据表添加了 SOT-23 (8) (DDF) 封装Go

Changes from B Revision (April 2018) to C Revision

  • Deleted 从器件信息 表中删除了 SOT-23 封装预览符号Go
  • Added 向器件信息 表添加了 SC70 封装Go
  • Added DCK package information to Device Comparison TableGo
  • Deleted DBV package preview notation from Pin Configuration and Functions sectionGo
  • Added DCK package drawing and pin functions to Pin Configuration and Functions sectionGo
  • Added DBV (SOT-23) and DCK (SC70) thermal informationGo

Changes from A Revision (October 2017) to B Revision

  • Added DGK package to Thermal Information table Go

Changes from * Revision (July 2017) to A Revision

  • Deleted 删除了器件信息 表中的 MCP6291 SC70、SOT-553 和 SOIC 封装Go
  • Deleted 删除了器件信息 表中的 MCP6292 WSON 和 VSSOP (10) 封装Go
  • Changed 将器件信息 表中的 MCP6294 14 引脚 SOIC 封装从预览更改为生产数据Go
  • Deleted DCK, DRL, DSG, RTE and 8-pin D packages from Device Comparison table Go
  • Deleted DRL (SOT-533) package from MCP6291 pinout image and table in Pin Configuration and Functions section Go
  • Deleted MCP6291 DCK (SC70) and D (SOIC) package pinout drawings and pin information from Pin Configuration and Functions sectionGo
  • Deleted MCP6292 DSG (WSON) and DGS (VSSOP) package pinout drawings and pin table information in Pin Configuration and Functions section Go
  • Deleted package preview note from MCP6294 pinout drawing in Pin Configuration and Functions section Go
  • Added MCP6294 Thermal Information table Go