ZHCSLV4 December   2020 LP875761-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Serial Bus Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Descriptions
      1. 7.3.1 Multi-Phase DC/DC Converters
        1. 7.3.1.1 Overview
        2. 7.3.1.2 Multiphase Switcher Configurations
        3. 7.3.1.3 Buck Converter Load-Current Measurement
        4. 7.3.1.4 Spread-Spectrum Mode
      2. 7.3.2 Sync Clock Functionality
      3. 7.3.3 Power-Up
      4. 7.3.4 Regulator Control
        1. 7.3.4.1 Enabling and Disabling Regulators
      5. 7.3.5 Enable and Disable Sequences
      6. 7.3.6 Device Reset Scenarios
      7. 7.3.7 Diagnosis and Protection Features
        1. 7.3.7.1 Power-Good Information (PGOOD pin)
        2. 7.3.7.2 Warnings for Diagnosis (Interrupt)
          1. 7.3.7.2.1 Output Power Limit
          2. 7.3.7.2.2 Thermal Warning
        3. 7.3.7.3 Protection (Regulator Disable)
          1. 7.3.7.3.1 Short-Circuit and Overload Protection
          2. 7.3.7.3.2 Overvoltage Protection
          3. 7.3.7.3.3 Thermal Shutdown
        4. 7.3.7.4 Fault (Power Down)
          1. 7.3.7.4.1 Undervoltage Lockout
      8. 7.3.8 GPIO Signal Operation
      9. 7.3.9 Digital Signal Filtering
    4. 7.4 Device Functional Modes
      1. 7.4.1 Modes of Operation
    5. 7.5 Programming
      1. 7.5.1 I2C-Compatible Interface
        1. 7.5.1.1 Data Validity
        2. 7.5.1.2 Start and Stop Conditions
        3. 7.5.1.3 Transferring Data
        4. 7.5.1.4 I2C-Compatible Chip Address
        5. 7.5.1.5 Auto-Increment Feature
    6. 7.6 Register Maps
      1. 7.6.1 Register Descriptions
        1.       53
        2. 7.6.1.1  DEV_REV
        3. 7.6.1.2  OTP_REV
        4. 7.6.1.3  BUCK0_CTRL1
        5. 7.6.1.4  BUCK0_CTRL2
        6. 7.6.1.5  BUCK1_CTRL2
        7. 7.6.1.6  BUCK2_CTRL2
        8. 7.6.1.7  BUCK3_CTRL2
        9. 7.6.1.8  BUCK0_DELAY
        10. 7.6.1.9  GPIO2_DELAY
        11. 7.6.1.10 GPIO3_DELAY
        12. 7.6.1.11 RESET
        13. 7.6.1.12 CONFIG
        14. 7.6.1.13 INT_TOP1
        15. 7.6.1.14 INT_TOP2
        16. 7.6.1.15 INT_BUCK_0_1
        17. 7.6.1.16 INT_BUCK_2_3
        18. 7.6.1.17 TOP_STAT
        19. 7.6.1.18 BUCK_0_1_STAT
        20. 7.6.1.19 BUCK_2_3_STAT
        21. 7.6.1.20 TOP_MASK1
        22. 7.6.1.21 TOP_MASK2
        23. 7.6.1.22 BUCK_0_1_MASK
        24. 7.6.1.23 BUCK_2_3_MASK
        25. 7.6.1.24 SEL_I_LOAD
        26. 7.6.1.25 I_LOAD_2
        27. 7.6.1.26 I_LOAD_1
        28. 7.6.1.27 PGOOD_CTRL1
        29. 7.6.1.28 PGOOD_CTRL2
        30. 7.6.1.29 PGOOD_FLT
        31. 7.6.1.30 PLL_CTRL
        32. 7.6.1.31 PIN_FUNCTION
        33. 7.6.1.32 GPIO_CONFIG
        34. 7.6.1.33 GPIO_IN
        35. 7.6.1.34 GPIO_OUT
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Inductor Selection
        2. 8.2.1.2 Input Capacitor Selection
        3. 8.2.1.3 Output Capacitor Selection
        4. 8.2.1.4 Snubber Components
        5. 8.2.1.5 Supply Filtering Components
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 接收文档更新通知
    2. 11.2 支持资源
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RNF|26
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Pin Configuration and Functions

GUID-8B8039B4-ECC5-4360-9953-37F44C39DA47-low.gifFigure 5-1 RNF Package26-Pin VQFN-HR With Thermal PadTop View
Table 5-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NO. NAME
1 FB_B2 A Output voltage feedback (positive) for the BUCK2 converter.
2 EN3 D/I/O Programmable enable signal for the buck regulators (can be also configured to select between two buck output-voltage levels). This pin functions alternatively as GPIO3.
3 CLKIN D/I External clock input. Connect this pin to ground if the external clock is not used.
4, 17, Thermal Pad AGND G Ground
5 SCL D/I Serial interface clock input for I2C access. Connect this pin to a pullup resistor.
6 SDA D/I/O Serial interface data input and output for I2C access. Connect this pin to a pullup resistor.
7 EN1 D/I/O Programmable enable signal for the buck regulators (can be also configured to select between two buck output voltage levels). This pin functions alternatively as GPIO1.
8 FB_B0 A Output voltage feedback (positive) for the BUCK0 converter.
9 VIN_B0 P Input for the BUCK0 converter. The separate power pins, VIN_Bx, are not connected together internally. The VIN_Bx pins must be connected together in the application and be locally bypassed.
10 SW_B0 A BUCK0 switch node
11 PGND_B01 G Power ground for the BUCK0 and BUCK1 converters
12 SW_B1 A BUCK1 switch node
13 VIN_B1 P Input for the BUCK1 converter. The separate power pins, VIN_Bx, are not connected together internally. The VIN_Bx pins must be connected together in the application and be locally bypassed.
14 FB_B1 A Output voltage feedback (positive) for the BUCK1 converter. This pin functions alternatively as the output ground feedback (negative) for the BUCK0 converter.
15 EN2 D/I/O Programmable enable signal for the buck regulators (can be also configured to select between two buck output voltage levels). This pin functions alternatively as GPIO2.
16 PGOOD D/O Power-good indication signal
18 VANA P Supply voltage for the analog and digital blocks. This pin must be connected to the same node as VIN_Bx.
19 nINT D/O Open-drain interrupt output. This pin is active low.
20 NRST D/I Reset signal for the device
21 FB_B3 A Output voltage feedback (positive) for the BUCK3 converter. This pin functions alternatively as the output ground feedback (negative) for the BUCK2 converter.
22 VIN_B3 P Input for the BUCK3 converter. The separate power pins, VIN_Bx, are not connected together internally. The VIN_Bx pins must be connected together in the application and be locally bypassed.
23 SW_B3 A BUCK3 switch node
24 PGND_B23 G Power ground for the BUCK2 and BUCK3 converters
25 SW_B2 A BUCK2 switch node
26 VIN_B2 P Input for the BUCK2 converter. The separate power pins, VIN_Bx, are not connected together internally. The VIN_Bx pins must be connected together in the application and be locally bypassed.
(1) A: Analog Pin, D: Digital Pin, G: Ground Pin, P: Power Pin, I: Input Pin, O: Output Pin