ZHCSU09H
July 2004 – December 2023
LP2981
,
LP2981A
PRODUCTION DATA
1
1
特性
2
应用
3
说明
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Electrical Characteristics
5.6
Typical Characteristics
6
Detailed Description
6.1
Overview
6.2
Functional Block Diagram
6.3
Feature Description
6.3.1
Output Enable
6.3.2
Dropout Voltage
6.3.3
Current Limit
6.3.4
Undervoltage Lockout (UVLO)
6.3.5
Thermal Shutdown
6.3.6
Output Pulldown
6.4
Device Functional Modes
6.4.1
Device Functional Mode Comparison
6.4.2
Normal Operation
6.4.3
Dropout Operation
6.4.4
Disabled
7
Application and Implementation
7.1
Application Information
7.1.1
Recommended Capacitor Types
7.1.1.1
Recommended Capacitors for the Legacy Chip
7.1.1.1.1
Tantalum Capacitors
7.1.1.1.2
Ceramic Capacitors
7.1.1.1.3
Aluminum Capacitors
7.1.1.2
Recommended Capacitors for the New Chip
7.1.2
Input and Output Capacitor Requirements
7.1.2.1
Input Capacitor
7.1.2.2
Output Capacitor
7.1.3
Estimating Junction Temperature
7.1.4
Power Dissipation (PD)
7.1.5
Reverse Current
7.2
Typical Application
7.2.1
Design Requirements
7.2.2
Detailed Design Procedure
7.2.2.1
ON and OFF Input Operation
7.2.3
Application Curves
8
Power Supply Recommendations
9
Layout
9.1
Layout Guidelines
9.2
Layout Example
10
Device and Documentation Support
10.1
Device Nomenclature
10.2
Documentation Support
10.2.1
Related Documentation
10.3
Receiving Notification of Documentation Updates
10.4
支持资源
10.5
Trademarks
10.6
静电放电警告
10.7
术语表
11
Revision History
12
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
DBV|5
MPDS018S
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsu09h_oa
zhcsu09h_pm
10.6
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。