ZHCSU10O March   2000  – December 2023 LP2981-N

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Output Enable
      2. 6.3.2 Dropout Voltage
      3. 6.3.3 Current Limit
      4. 6.3.4 Undervoltage Lockout (UVLO)
      5. 6.3.5 Thermal Shutdown
      6. 6.3.6 Output Pulldown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Device Functional Mode Comparison
      2. 6.4.2 Normal Operation
      3. 6.4.3 Dropout Operation
      4. 6.4.4 Disabled
  8. Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Recommended Capacitor Types
        1. 7.1.1.1 Recommended Capacitors for the Legacy Chip
        2. 7.1.1.2 Recommended Capacitors for the New Chip
      2. 7.1.2 Input and Output Capacitor Requirements
      3. 7.1.3 Estimating Junction Temperature
      4. 7.1.4 Power Dissipation (PD)
      5. 7.1.5 Reverse Current
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 ON and OFF Input Operation
      3. 7.2.3 Application Curves
  9. Power Supply Recommendations
  10. Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 第三方产品免责声明
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Related Documentation
    5. 10.5 支持资源
    6. 10.6 Trademarks
    7. 10.7 静电放电警告
    8. 10.8 术语表
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

特性

  • 输入电压 (VIN) 范围:
    • 旧芯片:2.1V 至 16V
    • 新芯片:2.5V 至 16V
  • 输出电压 (VOUT) 范围:1.2V 至 5.0V
  • 输出电压 (VOUT) 精度:
    • A 级旧芯片为 ±0.75%
    • 标准级旧芯片为 ±1.25%
    • 新芯片 ±0.5%(A 级和标准级)
  • 负载和温度范围内的输出电压 (VOUT) 精度: ±1%(新芯片)
  • 输出电流:高达 100mA
  • 低 IQ(新芯片):ILOAD = 0mA 时为 69μA
  • 低 IQ(新芯片):ILOAD = 100mA 时为 620μA
  • 关断电流与温度间的关系:
    • < 1μA(旧芯片)
    • ≤ 1.75μA(新芯片)
  • 输出电流限制和热保护
  • 使用 2.2µF 陶瓷电容器实现稳定工作(新芯片)
  • 高 PSRR(新芯片):
    • 1kHz 频率下为 75dB,1MHz 频率下为 45dB
  • 工作结温:–40°C 至 +125°C
  • 封装:5 引脚 SOT-23 (DBV)