ZHCSD73D August   2012  – August 2018 LMZ21700

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化原理图
      2.      VIN = 12V 时的效率
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1. Table 1. Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Package Construction
    4. 7.4 Feature Description
      1. 7.4.1 Input Under Voltage Lockout
      2. 7.4.2 Enable Input (EN)
      3. 7.4.3 Softstart and Tracking Function (SS)
      4. 7.4.4 Power Good Function (PG)
      5. 7.4.5 Output Voltage Setting
      6. 7.4.6 Output Current Limit and Output Short Circuit Protection
      7. 7.4.7 Thermal Protection
    5. 7.5 Device Functional Modes
      1. 7.5.1 PWM Mode Operation
      2. 7.5.2 PSM Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Capacitor (CIN)
        2. 8.2.2.2 Output Capacitor (COUT)
        3. 8.2.2.3 Softstart Capacitor (CSS)
        4. 8.2.2.4 Power Good Resistor (RPG)
        5. 8.2.2.5 Feedback Resistors (RFBB and RFBT)
      3. 8.2.3 Application Curves
        1. 8.2.3.1 VOUT = 1.2 V
        2. 8.2.3.2 VOUT = 1.8 V
        3. 8.2.3.3 VOUT = 2.5 V
        4. 8.2.3.4 VOUT = 3.3 V
        5. 8.2.3.5 VOUT = 5.0 V
    3. 8.3 Do's and Don'ts
  9. 9 Power Supply Recommendations
    1. 9.1 Voltage Range
    2. 9.2 Current Capability
    3. 9.3 Input Connection
      1. 9.3.1 Voltage Drops
      2. 9.3.2 Stability
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Minimize the High di/dt Loop Area
      2. 10.1.2 Protect the Sensitive Nodes in the Circuit
      3. 10.1.3 Provide Thermal Path and Shielding
    2. 10.2 Layout Example
      1. 10.2.1 High Density Layout Example for Space Constrained Applications
        1. 10.2.1.1 35 mm² Solution Size (Single Sided)
  11. 11器件和文档支持
    1. 11.1 器件支持
    2. 11.2 开发支持
      1. 11.2.1 使用 WEBENCH® 工具创建定制设计
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 术语表
  12. 12机械、封装和可订购信息
    1. 12.1 Tape and Reel Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • SIL|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.6 Typical Characteristics

Unless otherwise specified the following conditions apply: VIN = 12 V, TA = 25 °C
LMZ21700 D012_LMZ21700_PACKAGE_THERMAL_VS_PCB_SNVS872.gifFigure 2. Package Thermal Resistance vs. Board Copper Area, No Air Flow
LMZ21700 D006_LMZ21700_PD_85C_1.8VOUT_SNVS872.gif
VOUT = 1.8 V TA = 85 ºC
Figure 4. Power Dissipation
LMZ21700 D008_LMZ21700_PD_85C_3.3VOUT_SNVS872.gif
VOUT = 3.3 V TA = 85 ºC
Figure 6. Power Dissipation
LMZ21700 D011_LMZ21700_85C_DROPOUT_5VOUT_SNVS872.gif
VOUT = 5.0 V TA = 85 ºC
Figure 8. Dropout
LMZ21700 D002_LMZ21700_Radiated_EMI_SNVS872.gif
VIN= 12 V VOUT = 3.3 V IOUT = 650 mA
Figure 10. Radiated EMI on EVM
LMZ21700 D005_LMZ21700_PD_85C_1.2VOUT_SNVS872.gif
VOUT = 1.2 V TA = 85 ºC
Figure 3. Power Dissipation
LMZ21700 D007_LMZ21700_PD_85C_2.5VOUT_SNVS872.gif
VOUT = 2.5 V TA = 85 ºC
Figure 5. Power Dissipation
LMZ21700 D009_LMZ21700_PD_85C_5.0VOUT_SNVS872.gif
VOUT = 5.0 V TA = 85 ºC
Figure 7. Power Dissipation
LMZ21700 D010_LMZ21700_85C_DROPOUT_3.3VOUT_SNVS872.gif
VOUT = 3.3 V TA = 85 ºC
Figure 9. Dropout
LMZ21700 D001_LMZ21700_ConductedEMI_2.2uH_1uF_Filter_SNVS872.gif
VIN= 12 V VOUT = 3.3 V IOUT = 650 mA
Lf = 2.2 µH Cf = 1.0 µF
Figure 11. Conducted EMI on EVM