ZHCSD98A March   2013  – January 2015 LMT89

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 LMT89 Transfer Function
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Capacitive Loads
    2. 8.2 Typical Applications
      1. 8.2.1 Full-Range Centigrade Temperature Sensor
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Centigrade Thermostat
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
    3. 8.3 System Examples
      1. 8.3.1 Conserving Power Dissipation With Shutdown
      2. 8.3.2 Analog-to-Digital Converter Input Stage
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 商标
    2. 11.2 静电放电警告
    3. 11.3 术语表
  12. 12机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(3)
MIN MAX UNIT
Supply Voltage −0.2 6.5 V
Output Voltage (V+ + 0.6 V) −0.6 V
Output Current 10 mA
Input Current at any pin(2) 5 mA
Maximum Junction Temperature (TJMAX) 150 °C
Storage temperature (Tstg) −65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) When the input voltage (VI) at any pin exceeds power supplies (VI < GND or VI > V+), the current at that pin should be limited to 5 mA.
(3) Soldering process must comply with the Reflow Temperature Profile specifications. Refer to http://www.ti.com/packaging.. Reflow temperature profiles are different for lead-free and non-lead-free packages.

6.2 ESD Ratings

VALUE UNIT
V(ESD)(3) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2500 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±250
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(3) Accuracy is defined as the error between the measured and calculated output voltage at the specified conditions of voltage, current, and temperature (expressed in°C).

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
LMT89 with 2.4 V ≤ V+ ≤ 2.7 V −30 130 °C
LMT89 with 2.7 V ≤ V+ ≤ 5.5 V −55 130 °C
Supply Voltage Range (V+) 2.4 5.5 V

6.4 Thermal Information

THERMAL METRIC(1) LMT89 UNIT
SOT
5 PINS
RθJA Junction-to-ambient thermal resistance 282 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 93
RθJB Junction-to-board thermal resistance 62
ψJT Junction-to-top characterization parameter 1.6
ψJB Junction-to-board characterization parameter 62
RθJC(bot) Junction-to-case (bottom) thermal resistance —
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. For measured thermal resistance using specific printed circuit board layouts for the LMT89, see Layout.

6.5 Electrical Characteristics

Unless otherwise noted, these specifications apply for V+ = 2.7 VDC. All limits TA = TJ = TMIN to TMAX, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN(2) TYP(1) MAX(2) UNIT
Temperature to Voltage Error
VO = (−3.88 × 10−6× T2) + (−1.15 × 10−2 × T) + 1.8639 V(3)		 –2.5 ±1.5 2.5 °C
Output Voltage at 0°C 1.8639 V
Variance from Curve ±1.0 °C
Non-Linearity (4) –20°C ≤ TA ≤ 80°C ±0.4%
Sensor Gain (Temperature Sensitivity or Average Slope) to equation:
VO = −11.77 mV/°C × T + 1.860 V		 –30°C ≤ TA ≤ 100°C –12.2 –11.77 –11.4 mV/°C
Output Impedance Sourcing IL 0 μA to 16 μA (6)(7) 160 Ω
Load Regulation(5) Sourcing IL 0 μA to 16 μA (6)(7) –2.5 mV
Line Regulation(8) 2.4 V ≤ V+ ≤ 5.0 V 3.3 mV/V
5.0 V ≤ V+ ≤ 5.5 V 11 mV
Quiescent Current 2.4V ≤ V+ ≤ 5.0 V; TA = 25°C 4.5 7 μA
5.0V ≤ V+ ≤ 5.5 V; TA = 25°C 4.5 9 μA
2.4V ≤ V+ ≤ 5.0 V 4.5 10 μA
Change of Quiescent Current 2.4 V ≤ V+ ≤ 5.5 V 0.7 μA
Temperature Coefficient of Quiescent Current –11 nA/°C
Shutdown Current V+ ≤ 0.8 V 0.02 μA
(1) Typical values are at TJ = TA = 25°C and represent most likely parametric norm.
(2) Limits are specified to TI's AOQL (Average Outgoing Quality Level).
(3) Accuracy is defined as the error between the measured and calculated output voltage at the specified conditions of voltage, current, and temperature (expressed in°C).
(4) Non-Linearity is defined as the deviation of the calculated output-voltage-versus-temperature curve from the best-fit straight line, over the temperature range specified.
(5) Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating effects can be computed by multiplying the internal dissipation by the thermal resistance.
(6) The LMT89 can at most sink 1 μA and source 16 μA.
(7) Load regulation or output impedance specifications apply over the supply voltage range of 2.4 V to 5.5 V.
(8) Line regulation is calculated by subtracting the output voltage at the highest supply input voltage from the output voltage at the lowest supply input voltage.

6.6 Typical Characteristics

C001_SNIS176.png
Figure 1. Temperature Sensor Accuracy