ZHCSBP0B September   2013  – March 2014 LMP91300

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Terminal Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Oscillator
      2. 7.3.2  Detection
      3. 7.3.3  Comparator
      4. 7.3.4  Low RP, Close Target, Under Range Switch Enable
      5. 7.3.5  Programming The Switching Point And Hysteresis
      6. 7.3.6  Temperature Compensation
      7. 7.3.7  Power Supply
      8. 7.3.8  LED Drive
      9. 7.3.9  SWDRV
      10. 7.3.10 Overload Protection
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 Burning Programmed Values Into The Registers
      2. 7.5.2 Single-Wire Interface (SWIF)
        1. 7.5.2.1 Write Operation
        2. 7.5.2.2 Read Operation
      3. 7.5.3 Usage Priority Of Registers
    6. 7.6 Register Maps
      1. 7.6.1  DET_H_MSB_INIT - Detection High Threshold MSB (Initial) (Address 0x66)
      2. 7.6.2  DET_H_LSB_INIT - Detection High Threshold LSB (Initial) (Address 0x67)
      3. 7.6.3  DET_L_MSB_INIT - Detection Low Threshold MSB (Initial) (Address 0x68)
      4. 7.6.4  DET_L_LSB_INIT - Detection Low Threshold LSB (Initial) (Address 0x69)
      5. 7.6.5  INFO0 - Device Information 0 (Address 0x6A)
      6. 7.6.6  INFO1 - Device Information 1 (Address 0x6B)
      7. 7.6.7  INFO2 - Device Information 2 (Address 0x6C)
      8. 7.6.8  INFO3 - Device Information 3 (Address 0x6D)
      9. 7.6.9  OSC_CONFIG_0 - Oscillator Configuration 0 Register (Address 0x6E)
      10. 7.6.10 45
      11. 7.6.11 OSC_CONFIG_1 - Oscillator Configuration 1 Register (Address 0x6F)
      12. 7.6.12 OSC_CONFIG_2 - Oscillator Configuration 2 Register (Address 0x70)
      13. 7.6.13 OSC_CONFIG_3_INIT - Oscillator Configuration 3 Register (Initial) (Address 0x71)
      14. 7.6.14 OUT_CONFIG_INIT - Output Configuration Register (Initial) (Address 0x72)
      15. 7.6.15 DET_H_MSB_FNL - Detection High Threshold MSB (Final) (Address 0x73)
      16. 7.6.16 DET_H_LSB_FNL - Detection High Threshold LSB (Final) (Address 0x74)
      17. 7.6.17 DET_L_MSB_FNL - Detection Low Threshold MSB (Final) (Address 0x75)
      18. 7.6.18 DET_L_LSB_FNL - Detection Low Threshold LSB (Final) (Address 0x76)
      19. 7.6.19 OSC_CONFIG_3_FNL - Oscillator Configuration 3 Register (Final) (Address 0x77)
      20. 7.6.20 OUT_CONFIG_FNL - Output Configuration Register (Final) (Address 0x78)
      21. 7.6.21 TEMP64 - Temperature In °C + 64 (Address 0x79)
      22. 7.6.22 PROXIMITY_MSB - Proximity MSB (Address 0x7A)
      23. 7.6.23 PROXIMITY_LSB - Proximity LSB (Address 0x7B)
      24. 7.6.24 STATUS - Device Status (Address 0x7E)
      25. 7.6.25 BURN_REQ - Burn Request (Address 0x7F)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Quick Start
        2. 8.2.2.2  Determining The RP of an LC Tank
        3. 8.2.2.3  Component Selection And Layout
        4. 8.2.2.4  CF (CFA and CFB Terminals)
        5. 8.2.2.5  NTC (TEMP+ Terminal)
        6. 8.2.2.6  C1
        7. 8.2.2.7  CV+/EXT E
        8. 8.2.2.8  CBY (CBY Terminal)
        9. 8.2.2.9  RSENSE
        10. 8.2.2.10 REXT B (EXT B Terminal):
        11. 8.2.2.11 R1
        12. 8.2.2.12 SENSE1+ And SENSE2+ Terminals (RSENSE1+, RSENSE2+)
        13. 8.2.2.13 NPN
        14. 8.2.2.14 PNP
        15. 8.2.2.15 LED
        16. 8.2.2.16 LC Tank and INA and INB Terminals
        17. 8.2.2.17 SWDRV Terminal
        18. 8.2.2.18 P1 To P5 Terminals
        19. 8.2.2.19 GND Terminals
        20. 8.2.2.20 NC Terminals
        21. 8.2.2.21 Exposed DAP
        22. 8.2.2.22 SENSE-
      3. 8.2.3 Look-Up Table Calibration
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Glossary
  12. 12机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from A Revision (September 2013) to B Revision

  • Changed 将版面布局更改为全新的数据表格式Go
  • Added Burn Current Specification.Go
  • Added additional information to Low RP, Close Target, Under Range Switch Enable section. Go
  • Changed typo. Go
  • Added additional information to REXTB section. Go

Changes from * Revision (September 2013) to A Revision

  • Changed 更改为生产数据Go
  • Added CSP package Go