ZHCSGL2E December   2016  – December 2023 LMK62A2-100M , LMK62A2-150M , LMK62A2-156M , LMK62A2-200M , LMK62A2-266M , LMK62E0-156M , LMK62E2-100M , LMK62E2-156M , LMK62I0-100M , LMK62I0-156M

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics - Power Supply
    6. 5.6  LVPECL Output Characteristics
    7. 5.7  LVDS Output Characteristics
    8. 5.8  HCSL Output Characteristics
    9. 5.9  OE Input Characteristics
    10. 5.10 Frequency Tolerance Characteristics
    11. 5.11 Power-On/Reset Characteristics (VDD)
    12. 5.12 PSRR Characteristics
    13. 5.13 PLL Clock Output Jitter Characteristics
    14. 5.14 Additional Reliability and Qualification
  7. 6 Parameter Measurement Information
    1. 6.1 Device Output Configurations
  8. 7 Application and Implementation
    1. 7.1 Power Supply Recommendations
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
        1. 7.2.1.1 Ensuring Thermal Reliability
        2. 7.2.1.2 Best Practices for Signal Integrity
        3. 7.2.1.3 Recommended Solder Reflow Profile
  9. 8 Device and Documentation Support
    1. 8.1 接收文档更新通知
    2. 8.2 支持资源
    3. 8.3 Trademarks
    4. 8.4 静电放电警告
    5. 8.5 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • SIA|6
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.2.1.1 Ensuring Thermal Reliability

The LMK62XX is a high-performance device. Therefore, pay careful attention to the device configuration and printed-circuit board (PCB) layout with respect to power consumption. The ground pin must be connected to the ground plane of the PCB through three vias or more, as shown in Figure 7-1, to maximize thermal dissipation out of the package.

Equation 1 shows the relationship between the PCB temperature around the LMK62XX and the junction temperature.

Equation 1. TB = TJ – ΨJB × P

where

  • TB: PCB temperature around the LMK62XX
  • TJ: Junction temperature of LMK62XX
  • ΨJB: Junction-to-board thermal resistance parameter of LMK62XX (64.1°C/W without airflow)
  • P: On-chip power dissipation of LMK62XX

To ensure that the maximum junction temperature of LMK62XX is below 105°C, it can be calculated that the maximum PCB temperature without airflow should be at 81°C or below when the device is optimized for best performance, resulting in maximum on-chip power dissipation of 0.36 W.