ZHCSFA1C June   2016  – November 2017 LMK60A0-148351 , LMK60A0-148M , LMK60E0-156257 , LMK60E2-150M

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      引脚分配
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics - Power Supply
    6. 6.6  LVPECL Output Characteristics
    7. 6.7  LVDS Output Characteristics
    8. 6.8  HCSL Output Characteristics
    9. 6.9  OE Input Characteristics
    10. 6.10 Frequency Tolerance Characteristics
    11. 6.11 Power-On/Reset Characteristics (VDD)
    12. 6.12 PSRR Characteristics
    13. 6.13 PLL Clock Output Jitter Characteristics
    14. 6.14 Additional Reliability and Qualification
    15. 6.15 Typical Characteristics
  7. Parameter Measurement Information
    1. 7.1 Device Output Configurations
  8. Power Supply Recommendations
  9. Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 Ensuring Thermal Reliability
      2. 9.1.2 Best Practices for Signal Integrity
      3. 9.1.3 Recommended Solder Reflow Profile
  10. 10器件和文档支持
    1. 10.1 相关链接
    2. 10.2 接收文档更新通知
    3. 10.3 社区资源
    4. 10.4 商标
    5. 10.5 静电放电警告
    6. 10.6 Glossary
  11. 11机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • SIA|6
散热焊盘机械数据 (封装 | 引脚)
订购信息

Ensuring Thermal Reliability

The LMK60XX is a high performance device. Therefore pay careful attention to device configuration and printed-circuit board (PCB) layout with respect to power consumption. The ground pin needs to be connected to the ground plane of the PCB through three vias or more, as shown in Figure 12, to maximize thermal dissipation out of the package.

Equation 1 describes the relationship between the PCB temperature around the LMK60XX and its junction temperature.

Equation 1. TB = TJ – ΨJB * P

where

  • TB: PCB temperature around the LMK60XX
  • TJ: Junction temperature of LMK60XX
  • ΨJB: Junction-to-board thermal resistance parameter of LMK60XX (37.7°C/W without airflow)
  • P: On-chip power dissipation of LMK60XX

To ensure that the maximum junction temperature of LMK60XX is below 120°C, it can be calculated that the maximum PCB temperature without airflow should be at 90°C or below when the device is optimized for best performance resulting in maximum on-chip power dissipation of 0.68 W.