SNOS738I April   1995  – January 2017 LM9061 , LM9061-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings: LM9061
    3. 6.3 ESD Ratings: LM9061-Q1
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 MOSFET Gate Drive
      2. 7.3.2 Basic Operation
      3. 7.3.3 Turn On and Turn Off Characteristics
      4. 7.3.4 Lossless Overcurrent Protection
      5. 7.3.5 Delay Timer
        1. 7.3.5.1 Minimum Delay Time
      6. 7.3.6 Overvoltage Protection
      7. 7.3.7 Reverse Battery
      8. 7.3.8 Low Battery
      9. 7.3.9 Increasing MOSFET Turnon Time
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation With VCC > 30 V
      2. 7.4.2 Operation With VCC < 6.2 V
      3. 7.4.3 Operation With ON/OFF Control
      4. 7.4.4 MOSFET Latch-OFF
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 TITLE NEEDED
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Bidirectional Applications
        1. 8.2.2.1 Back-to-Back MOSFET Configuration
          1. 8.2.2.1.1 Application Curve
        2. 8.2.2.2 Bidirectional Switch With Reverse Overcurrent Protection
          1. 8.2.2.2.1 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

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Specifications

Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(1)
MIN MAX UNIT
Supply voltage 60 V
Output voltage VCC + 15 V
Voltage at sense and threshold (through 1 kΩ) −25 60 V
ON/OFF input voltage −0.3 VCC + 0.3 V
Reverse supply current 20 mA
Junction temperature 150 °C
Lead temperature soldering, 10 seconds 260 °C
Storage temperature, Tstg −55 150 °C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

ESD Ratings: LM9061

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

ESD Ratings: LM9061-Q1

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) ±2000 V
Charged-device model (CDM), per AEC Q100-011 All pins except 1, 4, 5, and 8 ±1000
Pins 1, 4, 5, and 8 ±1000
AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

Recommended Operating Conditions(1)

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
Supply voltage 7 26 V
ON/OFF input voltage −0.3 VCC V
Ambient temperature: LM9061 −40 125 °C
Junction temperature: LM9061-Q1 −40 125 °C
Operating Ratings indicate conditions for which the device is intended to be functional, but may not meet the ensured specific performance limits. For ensured specifications and test conditions see the Typical Characteristics.

Thermal Information

THERMAL METRIC(1) LM9061, LM9061-Q1 UNIT
D (SOIC)
8 PINS
RθJA Junction-to-ambient thermal resistance 150 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 46.7 °C/W
RθJB Junction-to-board thermal resistance 49.1 °C/W
ψJT Junction-to-top characterization parameter 6.2 °C/W
ψJB Junction-to-board characterization parameter 48.4 °C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report.

Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
7 V ≤ VCC ≤ 20 V, RREF = 15.4 kΩ, −40°C ≤ TJ ≤ +125°C, unless otherwise specified.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
POWER SUPPLY
IQ Quiescent supply current ON/OFF = 0 5 mA
ICC Operating supply current ON/OFF = 1, CLOAD = 0.025 µF,
includes turnon
transient output current
40 mA
ON/OFF CONTROL INPUT
VIN(0) ON/OFF input logic 0 VOUT = OFF 1.5 V
VIN(1) ON/OFF input logic 1 VOUT = ON 3.5 V
VHYST ON/OFF input hysteresis Peak-to-peak 0.8 2 V
IIN ON/OFF input pulldown current VON/OFF = 5 V 50 250 µA
GATE DRIVE OUTPUT
VOH Charge pump output voltage ON/OFF = 1 VCC + 7 VCC + 15 V
VOL OFF output voltage ON/OFF = 0, ISINK = 110 µA 0.9 V
VCLAMP Sense to output
clamp voltage
ON/OFF = 1,
VSENSE = VTHRESHOLD
11 15 V
ISINK(Normal-OFF) Output sink current
normal operation
ON/OFF = 0, VDELAY = 0 V,
VSENSE = VTHRESHOLD
75 145 µA
ISINK(Latch-OFF) Output sink current with
protection comparator tripped
VDELAY = 7 V,
VSENSE < VTHRESHOLD
5 15 µA
PROTECTION CIRCUITRY
VREF Reference voltage 1.15 1.35 V
IREF Threshold pin reference current VSENSE = VTHRESHOLD 75 88 µA
ITHR(LEAKAGE) Threshold pin leakage current VCC = Open, 7 V ≤ VTHRESHOLD ≤ 20 V 10 µA
ISENSE Sense pin input bias current VSENSE = VTHRESHOLD 10 µA
DELAY TIMER
VTIMER Delay timer threshold voltage 5 6.2 V
VSAT Discharge transistor saturation voltage IDIS = 1 mA 0.4 V
IDIS Delay capacitor discharge current VDELAY = 5 V 2 10 mA
IDELAY Delay pin source current 6.74 15.44 µA

Switching Characteristics

over operating free-air temperature range (unless otherwise noted)
7V ≤ VCC ≤ 20V, RREF = 15.4 kΩ, −40°C ≤ TJ ≤ +125°C, CLOAD = 0.025 µF, CDELAY = 0.022 µF, unless otherwise specified.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TON Output turnon time CLOAD = 0.025 µF 7V ≤ VCC ≤ 10 V, VOUT ≥ VCC + 7 V 1.5 ms
10V ≤ VCC ≤ 20 V, VOUT ≥ VCC + 11 V 1.5
TOFF(NORMAL) Output turnoff time,
normal operation(2)
CLOAD = 0.025 µF
VCC = 14 V, VOUT ≥ 25 V
VSENSE = VTHRESHOLD
4 10 ms
TOFF(Latch-OFF) Output turnoff time,
protection comparator tripped(2)
CLOAD = 0.025 µF
VCC = 14 V, VOUT ≥ 25 V
VSENSE = VTHRESHOLD
45 140 ms
TDELAY Delay timer interval CDELAY = 0.022 µF 8 18 ms
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications.
The AC Timing specifications for TOFF are not production tested, and therefore are not specifically ensured. Limits are provided for reference purposes only. Smaller load capacitances will have proportionally faster turn-ON and turn-OFF times.
LM9061 LM9061-Q1 1231705.png Figure 1. Typical Operating Waveforms
LM9061 LM9061-Q1 1231707.png Figure 2. Timing Definitions

Typical Characteristics

LM9061 LM9061-Q1 1231717.png Figure 3. Standby Supply Current vs VCC
LM9061 LM9061-Q1 1231719.png Figure 5. Output Voltage vs VCC
LM9061 LM9061-Q1 1231721.png Figure 7. Output Sink Current vs Temperature
LM9061 LM9061-Q1 1231723.png Figure 9. Reference Voltage vs Temperature
LM9061 LM9061-Q1 1231725.png Figure 11. Delay Charge Current vs Temperature
LM9061 LM9061-Q1 1231718.png Figure 4. Operating Supply Current vs VCC
LM9061 LM9061-Q1 1231720.png Figure 6. Output Sink Current vs Temperature
LM9061 LM9061-Q1 1231722.png Figure 8. Output Source Current vs Output Voltage
LM9061 LM9061-Q1 1231724.png Figure 10. Delay Threshold vs Temperature