SNVS052E September   1999  – April 2016 LM809 , LM810

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Benefits of Precision Reset Thresholds
        1. 7.3.1.1 Ensuring a Valid Reset Output Down to VCC = 0 V
        2. 7.3.1.2 Negative-Going VCC Transients
        3. 7.3.1.3 Interfacing to µPs with Bidirectional Reset Pins
    4. 7.4 Device Functional Modes
      1. 7.4.1 VCC Supply Voltage Low
      2. 7.4.2 VCC Supply Voltage High
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Related Links
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

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6 Specifications

6.1 Absolute Maximum Ratings

see (1)(2)
MIN MAX UNIT
Input supply voltage VCC –0.3 6 V
Output voltage RESET, RESET –0.3 VCC + 0.3 V
Input current VCC 20 mA
Output current RESET, RESET 20 mA
Rate of rise VCC 100 V/µs
Continuous power dissipation 320 mW
Lead temperature (soldering, 10 s) 300 °C
Ambient temperature range, TA –40 105 °C
Maximum junction temperature, TJ(MAX) 125 °C
Storage temperature, Tstg –65 160 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±200
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250-V CDM is possible with the necessary precautions. Pins listed as ±200 V may actually have higher performance.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VCC Input voltage range TA = 0°C to 70°C 1.0 5.5 V
TA = –40°C to 105°C 1.2 5.5
ICC Supply Current VCC < 5.5 V,
LM8xx: 4.63, 4.38, 4.00		 TA = –40°C to 85°C 18 60 µA
TA = 85°C to 105°C 100
VCC < 3.6 V,
LM8xx: 3.08, 2.93, 2.63, 2.45		 TA = –40°C to 85°C 15 50
TA = 85°C to 105°C 100

6.4 Thermal Information

THERMAL METRIC(1) LM809, LM810 UNIT
DBZ (SOT-23)
3 PINS
RθJA Junction-to-ambient thermal resistance 252.0 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 113.3 °C/W
RθJB Junction-to-board thermal resistance 53.5 °C/W
ψJT Junction-to-top characterization parameter 9.9 °C/W
ψJB Junction-to-board characterization parameter 52.6 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

VCC = full range, TA = –40°C to 105°C, unless otherwise noted. Typical values are at TA = 25°C, VCC = 5 V for 4.63, 4.38, and 4.00 versions, VCC = 3.3 V for 3.08 and 2.93 versions, and VCC = 3 V for 2.63 and 2.45 version(1).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VTH Reset Threshold(2) LM8xx: 4.63 V TA = 25°C 4.56 4.63 4.70 V
TA = –40°C to 85°C 4.50 4.75
TA = 85°C to 105°C 4.40 4.86
LM8xx: 4.38 V TA = 25°C 4.31 4.38 4.45
TA = –40°C to 85°C 4.25 4.50
TA = 85°C to 105°C 4.16 4.56
LM8xx: 4.00 V TA = 25°C 3.93 4.00 4.06
TA = –40°C to 85°C 3.89 4.10
TA = 85°C to 105°C 3.80 4.20
LM8xx: 3.08 V TA = 25°C 3.04 3.08 3.11
TA = –40°C to 85°C 3.00 3.15
TA = 85°C to 105°C 2.92 3.23
LM8xx: 2.93 V TA = 25°C 2.89 2.93 2.96
TA = –40°C to 85°C 2.85 3.00
TA = 85°C to 105°C 2.78 3.08
LM8xx: 2.63 V TA = 25°C 2.59 2.63 2.66
TA = –40°C to 85°C 2.55 2.70
TA = 85°C to 105°C 2.50 2.76
LM8xx: 2.45 V TA = 25°C 2.41 2.45 2.49
TA = –40°C to 85°C 2.38 2.52
TA = 85°C to 105°C 2.33 2.57
Reset Threshold Temperature Coefficient 30 ppm/°C
VCC to Reset Delay(2) VCC = VTH to (VTH – 100 mV) 20 µs
Reset Active Timeout Period TA = –40°C to 85°C 140 240 560 ms
TA = 85°C to 105°C 100 840
VOL RESET Output Voltage Low (LM809) VCC = VTH(min), ISINK = 1.2 mA, LM809: 2.45, 2.63, 2.93, 3.08 0.3 V
VCC = VTH(min), ISINK = 3.2 mA, LM809: 4.63, 4.38, 4.00 0.4
VCC > 1 V, ISINK = 50 µA 0.3
RESET Output Voltage Low (LM810) VCC = VTH(max), ISINK = 1.2 mA, LM810: 2.63, 2.93, 3.08 0.3
VCC = VTH(max), ISINK = 3.2 mA, LM810: 4.63, 4.38, 4.00 0.4
VOH RESET Output Voltage High (LM809) VCC > VTH(max), ISOURCE = 500 µA, LM809: 2.45, 2.63, 2.93, 3.08 0.8 × VCC V
VCC > VTH(max), ISOURCE = 800 µA, LM809: 4.63, 4.38, 4.00 VCC – 1.5
RESET Output Voltage High (LM810) 1.8 V < VCC < VTH(min), ISOURCE = 150 μA 0.8 × VCC
(1) Production testing done at TA = 25°C, over temperature limits specified by design only.
(2) RESET Output for LM809, RESET output for LM810.

6.6 Typical Characteristics

LM809 LM810 10105703.gif Figure 1. Supply Current vs Temperature
(No Load, LM8xx: 2.63, 2.93, 3.08)
LM809 LM810 10105705.gif Figure 3. Power-Down Reset Delay vs Temp
(LM8xx: 2.63, 2.93, 3.08)
LM809 LM810 10105707.gif Figure 5. Power-Up Reset Timeout vs Temperature
LM809 LM810 10105704.gif Figure 2. Supply Current vs Temperature
(No Load, LM8xx: 4.63, 4.38)
LM809 LM810 10105706.gif Figure 4. Power-Down Reset Delay vs Temperature
(LM8xx: 4.63, 4.38)
LM809 LM810 10105708.gif Figure 6. Normalized Reset Threshold vs Temperature