ZHCSC02H September   2012  – September 2015 LM3642

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Amplifier Synchronization (TX/TORCH)
      2. 7.3.2 Input Voltage Flash Monitor (IVFM)
      3. 7.3.3 Fault and Protections
        1. 7.3.3.1 Fault Operation
        2. 7.3.3.2 Flash Time-Out
        3. 7.3.3.3 Overvoltage Protection (OVP)
        4. 7.3.3.4 Current Limit
        5. 7.3.3.5 Undervoltage Lockout (UVLO)
        6. 7.3.3.6 Thermal Shutdown (TSD)
        7. 7.3.3.7 LED and/or VOUT Fault
    4. 7.4 Device Functional Modes
      1. 7.4.1 Start-up (Enabling the Device)
      2. 7.4.2 Pass Mode
      3. 7.4.3 Flash Mode
      4. 7.4.4 Torch Mode
      5. 7.4.5 Indicator Mode
    5. 7.5 Programming
      1. 7.5.1 I2C-Compatible Interface
        1. 7.5.1.1 Data Validity
        2. 7.5.1.2 Start and Stop Conditions
        3. 7.5.1.3 Transferring Data
        4. 7.5.1.4 I2C-Compatible Chip Address
        5. 7.5.1.5 Transferring Data
    6. 7.6 Register Map
      1. 7.6.1 Register Descriptions
        1. 7.6.1.1 Enable Register (0x0A)
        2. 7.6.1.2 Flags Register (0x0B)
        3. 7.6.1.3 Flash Features Register (0x08)
        4. 7.6.1.4 Current Control Register (0x09)
        5. 7.6.1.5 Input Voltage Flash Monitor (IVFM) Mode Register (0x01)
        6. 7.6.1.6 Torch Ramp Time Register (0x06)
        7. 7.6.1.7 Silicon Revision Register
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Output Capacitor Selection
        2. 8.2.2.2 Input Capacitor Selection
        3. 8.2.2.3 Inductor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 商标
    4. 11.4 社区资源
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from G Revision (December 2014) to H Revision

  • Changed Handling Ratings table to ESD Ratings table per SDS format; move Storage Temp to Abs Max table Go
  • Added "If an I2C command is used to terminate the flash event, TI recommends selecting a flash time-out level 100 ms above the desired flash duration ." to end of Flash Time-Out subsectionGo

Changes from F Revision (December 2013) to G Revision

  • Added 引脚配置和功能部分，处理额定值表，特性 描述 部分，器件功能模式，应用和实施部分，电源相关建议部分，布局部分，器件和文档支持部分以及机械、封装和可订购信息部分Go
  • Added updated full Thermal Information Go

Changes from E Revision (May 2013) to F Revision

  • Deleted TX interruptGo