ZHCSNW6G december   2003  – march 2023 LM2901-Q1 , LM2901AV-Q1 , LM2901B-Q1 , LM2901V-Q1

PRODMIX  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings for  LM2901B-Q1
    2. 6.2  Absolute Maximum Ratings for LM2901x-Q1
    3. 6.3  ESD Ratings for LM2901B-Q1
    4. 6.4  ESD Ratings for LM2901x-Q1
    5. 6.5  Recommended Operating Conditions for LM2901B-Q1
    6. 6.6  Recommended Operating Conditions for LM2901x-Q1
    7. 6.7  Thermal Information for LM2901B-Q1
    8. 6.8  Thermal Information for LM2901x-Q1
    9. 6.9  Electrical Characteristics for LM2901B-Q1
    10. 6.10 Switching Characteristics for LM2901B-Q1
    11. 6.11 Electrical Characteristics for LM2901x-Q1
    12. 6.12 Switching Characteristics for LM2901x-Q1
    13. 6.13 Typical Characteristics: LM2901B-Q1
    14. 6.14 Typical Characteristics: LM2901x-Q1
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Voltage Comparison
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Voltage Range
        2. 8.2.2.2 Minimum Overdrive Voltage
        3. 8.2.2.3 Output and Drive Current
        4. 8.2.2.4 Response Time
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Trademarks
    4. 11.4 静电放电警告
    5. 11.5 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • D|14
  • PW|14
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.8 Thermal Information for LM2901x-Q1

THERMAL METRIC(1)LM2901x-Q1UNIT
D
(SOIC)		PW
(TSSOP)
14 PINS14 PINS
RθJAJunction-to-ambient thermal resistance(2)88.6119.1°C/W
RθJC(top)Junction-to-case (top) thermal resistance49.147.9°C/W
RθJBJunction-to-board thermal resistance43.060.9°C/W
ψJTJunction-to-top characterization parameter13.65.4°C/W
ψJBJunction-to-board characterization parameter42.760.3°C/W
(1) For more information about traditional and new thermal metrics, see the Semicondctor and IC Package Thermal Metrics application report, SPRA953.
(2) Maximum power dissipation is a function of TJ(max), RθJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) − TA) / RθJA. Operating at the absolute maximum TJ of 150°C can affect reliability.