ZHCSDO1 May   2015 LM2775

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Pre-Regulation
      2. 7.3.2 Input Current Limit
      3. 7.3.3 PFM Mode
      4. 7.3.4 Output Discharge
      5. 7.3.5 Thermal Shutdown
      6. 7.3.6 Undervoltage Lockout
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown
      2. 7.4.2 Boost Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Output Current Capability
        2. 8.2.2.2 Efficiency
        3. 8.2.2.3 Power Dissipation
        4. 8.2.2.4 Recommended Capacitor Types
        5. 8.2.2.5 Output Capacitor and Output Voltage Ripple
        6. 8.2.2.6 Input Capacitor and Input Voltage Ripple
        7. 8.2.2.7 Flying Capacitor
      3. 8.2.3 Application Curve
      4. 8.2.4 USB OTG / Mobile HDMI Power Supply
        1. 8.2.4.1 Design Requirements
        2. 8.2.4.2 Detailed Design Procedure
        3. 8.2.4.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 商标
    2. 11.2 静电放电警告
    3. 11.3 术语表
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VIN, VOUT –0.3 6 V
EN, OUTDIS, PFM –0.3 VIN + 0.3 with 6 V Max V
Continuous power dissipation Internally Limited °C
Junction temperature (TJ-MAX) 125 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±1000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±250
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VIN 2.7 5.5 V
Junction temperature (TJ ) –40 125 °C
Ambient temperature (TA ) –40 85 °C

6.4 Thermal Information

THERMAL METRIC(1) LM2775 UNIT
DSG (WSON)
8 PINS
RθJA Junction-to-ambient thermal resistance 71.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 95.0
RθJB Junction-to-board thermal resistance 41.5
ψJT Junction-to-top characterization parameter 3.2
ψJB Junction-to-board characterization parameter 41.8
RθJC(bot) Junction-to-case (bottom) thermal resistance 12.8
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

Typical limits tested at TA = 25°C. Minimum and maximum limits apply over the full operating ambient temperature range (−40°C ≤ TA ≤ 85°C). VIN = 3.6 V, CIN = COUT = 2.2 µF, C1 = 1 µF
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOUT Output voltage regulation IOUT = 180 mA 4.8 5 5.2 V
IQ Quiescent current IOUT = 0 mA, PFM = ‘1’ 75 150 µA
IOUT = 0 mA, PFM = ‘0’ 5 mA
ISD Shutdown current EN = '0' 0.7 3 µA
IOUTDIS Output discharge current OUTDIS = '1' 500 µA
ICL Input current limit 600 mA
VIL Input logic low: EN, OUTDIS, PFM 0 0.4 V
VIH Input logic high: EN, OUTDIS, PFM 1.2 VIN V
UVLO Undervoltage lockout VIN falling 2.4 V
VIN rising 2.6

6.6 Switching Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ƒSW Switching frequency 1.7 2 2.3 MHz

6.7 Typical Characteristics

TA = 25°C, VIN = 3.6 V, CIN = COUT = 10 µF (10-V 0402 case), C1 = 1 µF (10-V 0402 case), VEN = VIN.
LM2775 D001_SNVSA57-LM2775.gif
ILOAD = 200 mA PFM = '0'
Figure 1. PWM Output Regulation
LM2775 D002_SNVSA57-LM2775.gif
ILOAD = 200 mA PFM = '1'
Figure 2. PFM Output Regulation
LM2775 D003_SNVSA57-LM2775.gif
VIN = 3.3 V PFM = '0'
Figure 3. Load Regulation
LM2775 D016_SNVSA57-LM2775.gif
VIN = 2.7 V PFM = '0'
Figure 5. Load Regulation
LM2775 D017_SNVSA57-LM2775.gif
EN = '0' OUTDIS = '0'
Figure 7. Output Leakage Current
LM2775 D007_SNVSA57.gif
ILOAD = 0 mA PFM = '0'
Figure 9. PWM Quiescent Current
LM2775 D013_SNVSA57-LM2775.gif
ILOAD = 100 mA PFM = '0'
Figure 11. Efficiency vs Input Voltage
LM2775 D015_SNVSA57-LM2775.gif
VIN = 3.3 V PFM = '1'
Figure 13. Efficiency vs Load Current
LM2775 PWMLOADSTEP.gif
VIN = 3.6 V ILOAD = 1 mA to 100 mA PFM = '0'
Figure 15. PWM Load Step
LM2775 ACTIVEDIS.gif
VIN = 3.6 V OUTDIS = '1'
Figure 17. Output Discharge Enabled
LM2775 D004_SNVSA57-LM2775.gif
VIN = 3.3 V PFM = '1'
Figure 4. Load Regulation
LM2775 D005_SNVSA57-LM2775.gif
EN = '0'
Figure 6. Shutdown Current
LM2775 D006_SNVSA57-LM2775.gif
ILOAD = 0 mA PFM = '1'
Figure 8. PFM Quiescent Current
LM2775 D008_SNVSA57-LM2775.gif
Figure 10. Switching Frequency
LM2775 D014_SNVSA57-LM2775.gif
VIN = 3.3 V PFM = '0'
Figure 12. Efficiency vs Load Current
LM2775 PFMLOADSTEP.gif
VIN = 3.6 V ILOAD = 1 mA to 100 mA PFM = '1'
Figure 14. PFM Load Step
LM2775 HIGHZ.gif
VIN = 3.6 V OUTDIS = '0'
Figure 16. Output Discharge Disabled
LM2775 STARTUP100mA.gif
VIN = 3.6 V ILOAD = 100 mA
Figure 18. Start-Up into a Load