ZHCS547K January   2010  – February 2018 LM27402

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      典型应用电路
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Performance Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Wide Input Voltage Range
      2. 7.3.2  UVLO
      3. 7.3.3  Precision Enable
      4. 7.3.4  Soft-Start and Voltage Tracking
      5. 7.3.5  Output Voltage Setpoint and Accuracy
      6. 7.3.6  Voltage-Mode Control
      7. 7.3.7  Power Good
      8. 7.3.8  Inductor-DCR-Based Overcurrent Protection
      9. 7.3.9  Current Sensing
      10. 7.3.10 Power MOSFET Gate Drivers
      11. 7.3.11 Pre-Bias Start-up
    4. 7.4 Device Functional Modes
      1. 7.4.1 Fault Conditions
        1. 7.4.1.1 Thermal Protection
        2. 7.4.1.2 Current Limit
        3. 7.4.1.3 Negative Current Limit
        4. 7.4.1.4 Undervoltage Threshold (UVT)
        5. 7.4.1.5 Overvoltage Threshold (OVT)
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1  Converter Design
      2. 8.1.2  Inductor Selection (L)
      3. 8.1.3  Output Capacitor Selection (COUT)
      4. 8.1.4  Input Capacitor Selection (CIN)
      5. 8.1.5  Using Precision Enable
      6. 8.1.6  Setting the Soft-Start Time
      7. 8.1.7  Tracking
      8. 8.1.8  Setting the Switching Frequency
      9. 8.1.9  Setting the Current Limit Threshold
      10. 8.1.10 Control Loop Compensation
      11. 8.1.11 MOSFET Gate Drivers
      12. 8.1.12 Power Loss and Efficiency Calculations
        1. 8.1.12.1 Power MOSFETs
        2. 8.1.12.2 High-Side Power MOSFET
        3. 8.1.12.3 Low-Side Power MOSFET
        4. 8.1.12.4 Gate-Charge Loss
        5. 8.1.12.5 Input and Output Capacitor ESR Losses
        6. 8.1.12.6 Inductor Losses
        7. 8.1.12.7 Controller Losses
        8. 8.1.12.8 Overall Efficiency
    2. 8.2 Typical Applications
      1. 8.2.1 Example Circuit 1
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Custom Design With WEBENCH® Tools
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Example Circuit 2
      3. 8.2.3 Example Circuit 3
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Power Stage Layout
      2. 10.1.2 Gate Drive Layout
      3. 10.1.3 Controller Layout
      4. 10.1.4 Thermal Design and Layout
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 第三方产品免责声明
      2. 11.1.2 开发支持
        1. 11.1.2.1 使用 WEBENCH® 工具创建定制设计
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.1.12.2 High-Side Power MOSFET

The next set of equations are used to calculate the losses associated with the high-side MOSFET.

Equation 25. LM27402 30092649.gif

PCND_HS is the conduction loss of the high-side MOSFET during the D interval. this equation includes a self heating coefficient of 1.3 to approximate the effects of the RDS(on) temperature coefficient. RDS(ON)_HS is the drain to source resistance, IOUT is the output current and D is the duty ratio. PSW_HS is the switching power loss during the high-side MOSFET transition time. VIN is the input voltage, fSW is the switching frequency, and tr and tf are the rise and fall times of the switch-node voltage, respectively. PTOT_HS is the total power dissipation of the high-side MOSFET.

The gate charge of the high-side MOSFET greatly affects the turn-on transition time, and therefore efficiency. Furthermore, consider the ratio of switching loss to conduction loss associated with the high-side MOSFET. If the duty ratio is small and the input voltage is high, it is beneficial to tradeoff QG for higher RDS(on) to avoid high switching losses relative to conduction losses. If the duty ratio is large and the input voltage is low, then a lower RDS(on) MOSFET in tandem with a higher QG may result in less power dissipation.