ZHCSLW9
November 2022
ISOW7741-Q1
,
ISOW7742-Q1
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
说明(接续)
6
Pin Configuration and Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Power Ratings
7.6
Insulation Specifications
7.7
Safety-Related Certifications
7.8
Safety Limiting Values
7.9
Electrical Characteristics - Power Converter
7.10
Supply Current Characteristics - Power Converter
7.11
Electrical Characteristics Channel Isolator - VIO, VISOIN = 5-V
7.12
Supply Current Characteristics Channel Isolator - VIO, VISOIN = 5-V
7.13
Electrical Characteristics Channel Isolator - VIO, VISOIN = 3.3-V
7.14
Supply Current Characteristics Channel Isolator - VIO, VISOIN = 3.3-V
7.15
Electrical Characteristics Channel Isolator - VIO, VISOIN = 2.5-V
7.16
Supply Current Characteristics Channel Isolator - VIO, VISOIN = 2.5-V
7.17
Electrical Characteristics Channel Isolator - VIO, VISOIN = 1.8-V
7.18
Supply Current Characteristics Channel Isolator - VIO, VISOIN = 1.8-V
7.19
Switching Characteristics - 5-V Supply
7.20
Switching Characteristics - 3.3-V Supply
7.21
Switching Characteristics - 2.5-V Supply
7.22
Switching Characteristics - 1.8-V Supply
7.23
Insulation Characteristics Curves
7.24
Typical Characteristics
8
Parameter Measurement Information
9
Detailed Description
9.1
Overview
9.1.1
Power Isolation
9.1.2
Signal Isolation
9.2
Functional Block Diagram
9.3
Feature Description
9.3.1
Electromagnetic Compatibility (EMC) Considerations
9.3.2
Power-Up and Power-Down Behavior
9.3.3
Protection Features
9.4
Device Functional Modes
9.4.1
Device I/O Schematics
10
Application and Implementation
10.1
Application Information
10.2
Typical Application
10.2.1
Design Requirements
10.2.2
Detailed Design Procedure
10.2.3
Application Curve
10.2.4
Insulation Lifetime
11
Power Supply Recommendations
12
Layout
12.1
Layout Guidelines
12.1.1
PCB Material
12.2
Layout Example
13
Device and Documentation Support
13.1
Device Support
13.2
Documentation Support
13.2.1
Related Documentation
13.3
Receiving Notification of Documentation Updates
13.4
支持资源
13.5
Trademarks
13.6
Electrostatic Discharge Caution
13.7
术语表
14
Mechanical, Packaging, and Orderable Information
14.1
Package Option Addendum
14.1.1
Packaging Information
14.1.2
Tape and Reel Information
封装选项
机械数据 (封装 | 引脚)
DFM|20
MCSS009
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcslw9_oa
1
特性
符合汽车应用要求
具有符合 AEC-Q100 标准的下列特性:
器件温度等级 1:–40°C 至 +125°C 的环境温度范围
100 Mbps 数据速率
低辐射、低噪声的集成式直流/直流转换器
辐射经过优化,
符合 CISPR25
25 MHz 的低频电源转换器可实现低噪声性能
低输出波纹:24 mV
高效率输出功率
最大负载时的效率:46%
高达 0.55W 的输出功率
V
ISOOUT
精度为 5%
5V 至 5V:最大可用负载电流 = 110mA
5V 至 3.3V:最大可用负载电流 = 140mA
3.3V 至 3.3V:最大可用负载电流 = 60mA
用于通道隔离器和电源转换器的独立电源
逻辑电源 (V
IO
):1.71V 至 5.5V
电源转换器电源 (V
DD
):3V 至 5.5V
优异的电磁兼容性 (EMC)
系统级 ESD、EFT 和浪涌抗扰性
在整个隔离栅具有 ±8kV IEC 61000-4-2 接触放电保护
增强型和基础型隔离选项
高 CMTI:100 kV/µs(典型值)
安全相关认证:
符合 DIN EN IEC 60747-17 (VDE 0884-17) 标准的 VDE 增强型和基础型绝缘
UL 1577 组件认证计划
IEC 62368-1、IEC 61010-1、IEC 60601-1 和 GB 4943.1-2011 认证
ISOW774xB 器件已列入计划
扩展温度范围:–40°C 至 +125°C
20 引脚宽体 SOIC 封装