ZHCSE64C august   2015  – may 2023 ISO5452

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 说明（续）
  7. 6 Pin Configuration and Function
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Ratings
    6. 7.6  Insulation Specifications
    7. 7.7  Safety-Related Certifications
    8. 7.8  Safety Limiting Values
    9. 7.9  Electrical Characteristics
    10. 7.10 Switching Characteristics
    11. 7.11 Insulation Characteristics Curves
    12. 7.12 Typical Characteristics
  9. 8 Parameter Measurement Information
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Supply and Active Miller Clamp
      2. 9.3.2 Active Output Pull-down
      3. 9.3.3 Undervoltage Lockout (UVLO) with Ready (RDY) Pin Indication Output
      4. 9.3.4 Soft Turn-Off, Fault ( FLT) and Reset ( RST)
      5. 9.3.5 Short Circuit Clamp
    4. 9.4 Device Functional Modes
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1  Recommended ISO5452 Application Circuit
        2. 10.2.2.2  FLT and RDY Pin Circuitry
        3. 10.2.2.3  Driving the Control Inputs
        4. 10.2.2.4  Local Shutdown and Reset
        5. 10.2.2.5  Global-Shutdown and Reset
        6. 10.2.2.6  Auto-Reset
        7. 10.2.2.7  DESAT Pin Protection
        8. 10.2.2.8  DESAT Diode and DESAT Threshold
        9. 10.2.2.9  Determining the Maximum Available, Dynamic Output Power, POD-max
        10. 10.2.2.10 Example
        11. 10.2.2.11 Higher Output Current Using an External Current Buffer
      3. 10.2.3 Application Curves
  12. 11Power Supply Recommendations
  13. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 PCB Material
  14. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 第三方产品免责声明
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 接收文档更新通知
    4. 13.4 支持资源
    5. 13.5 Trademarks
    6. 13.6 静电放电警告
    7. 13.7 术语表
  15. 14Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DW|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision B (January 2017) to Revision C (May 2023)

  • Added Additional manufacturing certification pending in the Safety-Related Certifications tableGo

Changes from Revision A (September 2015) to Revision B (January 2017)

  • 将标题从有源安全特性 更改为有源保护特性 Go
  • 将“特性”从“浪涌抗扰度为 10000 VPK（根据 IEC 61000-4-5）”更改为可耐受的浪涌隔离电压高达 10000 VPK Go
  • Moved Insulation Specifications to the Specifications sectionGo
  • Changed RIO Test conditions From: TS To: TS = 150°C in Insulation Specifications Go
  • Moved Safety-Related Certifications to the Specifications sectionGo
  • Moved Safety Limiting Values to the Specifications sectionGo
  • Moved Insulation Characteristics Curves to the Specifications Go
  • Added text ", but connecting CLAMP output of the gate driver to the IGBT gate is also not an issue." to Supply and Active Miller Clamp Go
  • Deleted ground symbol on pin 11 of the Global Shutdown With Inverting Input Configuration figureGo
  • Deleted ground symbol on pin 11 on the inverting input of the Auto Reset for Noninverting and Inverting Input Configuration figureGo

Changes from Revision * (August 2015) to Revision A (September 2015)

  • 将首页的“产品预发布”更改为完整数据表Go
  • 将特性 部分的“50kV/μs 最小共模瞬态抗扰度和 100kV/μs 典型共模瞬态抗扰度...”移至列表顶部Go
  • 将所有认证的状态更改为完成Go
  • 更改了功能方框图，在引脚 OUTL 上添加了 STOGo
  • Changed RIO Test conditions From: 100°C ≤ TA ≤ max To: 100°C ≤ TA ≤ 125°C in Insulation Specifications Go
  • Changed the Safety-Related Certifications tableGo