ZHCSID5E April 2018 – September 2019 ISO1410 , ISO1412 , ISO1430 , ISO1432 , ISO1450 , ISO1452
UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.
请参考 PDF 数据表获取器件具体的封装图。
THERMAL METRIC(1) | ISO14xx | UNIT | |
---|---|---|---|
DW (SOIC) | |||
16 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 67.9 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 27.7 | °C/W |
RθJB | Junction-to-board thermal resistance | 29.4 | °C/W |
ψJT | Junction-to-top characterization parameter | 12.9 | °C/W |
ψJB | Junction-to-board characterization parameter | 28.8 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | °C/W |