ZHCSE00E may   2014  – december 2020 HD3SS215

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Description (continued)
  7. 6 Pin Configuration and Functions
    1.     Pin Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings #GUID-892340A8-A891-4B90-B8E2-B582AB533890/SLAS9018663 #GUID-892340A8-A891-4B90-B8E2-B582AB533890/SLAS9012713
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Electrical Characteristics, Device Parameters #GUID-222D29AA-746D-4606-8967-F0F2E648EFF8/SLAS9019128
    7. 7.7 Switching Characteristics
    8. 7.8 Timing Diagrams
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 High Speed Switching
      2. 8.3.2 HPD, AUX, and DDC Switching
      3. 8.3.3 Output Enable and Power Savings
    4. 8.4 Device Functional Modes
      1. 8.4.1 Switch Control Modes
  10. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 DisplayPort and Dual Mode Adapter with Two Sources
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
      2. 9.2.2 HDMI Application with Two Sinks
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
      3. 9.2.3 36
      4. 9.2.4 HDMI 2:1 Sink Application Using the RTQ Package
  11.   Power Supply Recommendations
  12. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  13. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
  14. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision D (September 2015) to Revision E (December 2020)

  • 注：采用 MicroStar Jr. BGA 封装的器件采用层压 nFBGA 封装进行了重新设计。这种 nFBGA 封装提供了类似于数据表中的电气性能。该封装占用空间也类似于 MicroStar Jr. BGA。将在整个数据表中更新全新封装标识符来代替已停止使用的封装标识符。Go
  • 将 u*jr ZQE 更改为 nFBGA ZXHGo
  • Changed u*jr ZQE to nFBGA ZXHGo
  • Changed u*jr ZQE to nFBGA ZXHGo
  • Changed u*jr ZQE to nFBGA ZXHGo
  • Changed u*jr ZQE to nFBGA ZXHGo
  • Changed u*jr ZQE to nFBGA ZXH. Updated thermal data.Go
  • Changed u*jr ZQE to nFBGA ZXHGo
  • Changed u*jr ZQE to nFBGA ZXHGo

Changes from Revision C (August 2015) to Revision D (September 2015)

  • 将 节 3 文本字符串从“....DisplayPort 1.2a...”更改为“...DisplayPort HBR2...”，以及从“..HDMI2.0..”更改为“...HDMI...”Go
  • Deleted RθJC(bot) spec from Thermal Information table as N/AGo
  • Deleted "Operating free air temperature" spec from Electrical Characteristics tableGo
  • Changed Figure 9-5 Go
  • Changed Section 10 text string from "Decoupling capacitors may be used to reduce noise and improve power supply integrity" to "Decoupling capacitors must be used to reduce power supply noise"Go

Changes from Revision B (July 2015) to Revision C (July 2015)

  • Added ton(OE_L-H), toff(OE_H-L), and tSWITCH_OVER to the Section 7.7 Go

Changes from Revision A (May 2014) to Revision B (July 2015)

  • 将标题从“2.0/DisplayPort 1.2A”更改为“DisplayPort”Go
  • 将 节 1 列表项从“符合 Displayport 1.2a 电气标准”更改为“符合 DisplayPort 电气标准”Go
  • 将 节 1 列表项从“符合 HDMI 1.4b 和 HDMI 2.0 电气标准”更改为“符合 HDMI 电气标准”Go
  • 添加了 节 1 项目：商用温度范围：–40°C 至 70°C (HD3SS215)Go
  • 添加了 节 1 项目：工业温度范围：–40°C 至 85°C (HD3SS215I)Go
  • 添加了 节 1 ，封装选项：8mm × 8mm，56 引脚 RTQGo
  • 将 节 2 列表项从“电视和监视器”更改为“UHDTV、HDTV 和监视器”Go
  • Added Section 5 paragraph. Go
  • Added the 56-Pin QFN imageGo
  • Added RTQ column to the Pin Functions table Go
  • Added RTQ column to the Pin Functions table Go
  • Moved Tstg From: Section 7.2 To: Section 7.1 Go
  • Changed the Handling Ratings table to Section 7.2 table Go
  • Added HD3SS2151I, Operating free-air temperature Section 7.3 Go
  • Added RTQ 56 PIN values to the Section 7.4 Go
  • Added table Note " This pin can be driven.." to the Section 7.5 tableGo
  • Changed the Section 7.6 table to include ZQE and RTQ package valuesGo
  • Added the Section 7.7 table Go
  • Added section: Section 9.2.4 Go
  • Added Figure 10-3 Go

Changes from Revision * (May 2014) to Revision A (May 2014)