ZHCSBL2C
December 2016 – January 2021
HD3SS213
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Timing Requirements
6.7
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.4
Device Functional Modes
8
Application and Implementation
8.1
Application Information
8.2
Typical Applications
8.2.1
HD3SS213 AUX Channel in 2:1 Application
8.2.1.1
Design Requirements
8.2.1.2
Detailed Design Procedure
8.2.1.3
Application Curves
8.2.2
HD3SS213 AUX Channel in 1:2 Application
Power Supply Recommendations
9
Layout
9.1
Layout Guidelines
9.1.1
Differential Traces
9.2
Layout Example
10
Device and Documentation Support
10.1
接收文档更新通知
10.2
支持资源
10.3
Trademarks
10.4
静电放电警告
10.5
术语表
11
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
ZXH|50
MPBGAS4
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsbl2c_oa
zhcsbl2c_pm
8.2.1.2
Detailed Design Procedure
Connect VDD and GND pins to the power and ground planes of the printed-circuit board with 0.1-µF bypass capacitor
Use VDD/2 logic level at AUX_SEL pin
Use 3.3-V TTL/CMOS logic level at Dx_SEL to connect DAx to DCx
Use GND logic level at Dx_SEL to connect DBx to DCx
Use controlled-impedance transmission media for all the differential signals
Ensure the received complimentary signals are with a differential amplitude of <1800 mV
PP
and a common-mode voltage of <2 V