SNLS045C July   1999  – July 2016 DS90LV048A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Fail-Safe Feature
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Probing LVDS Transmission Lines
        2. 9.2.2.2 Threshold
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Power Decoupling Recommendations
      2. 11.1.2 Differential Traces
      3. 11.1.3 Termination
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

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6 Specifications

6.1 Absolute Maximum Ratings

See (1)(2)
MIN MAX UNIT
Supply voltage (VCC) –0.3 4 V
Input voltage (RIN+, RIN−) –0.3 3.6 V
Enable input voltage (EN, EN*) –0.3 VCC + 0.3 V
Output voltage (ROUT) –0.3 VCC + 0.3 V
Maximum package power dissipation at +25°C D0016A package 1025 mW
PW0016A package 866
Derate D0016A package above +25°C 8.2 mW/°C
Derate PW0016A package above +25°C 6.9
Lead temperature soldering (4 s) 260 °C
Maximum junction temperature 150 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge(1) Human-body model (HBM) ±10000 V
Machine model ±1200
(1) ESD Rating:
HBM (1.5 kΩ, 100 pF)
EIAJ (0 Ω, 200 pF)

6.3 Recommended Operating Conditions

MIN NOM MAX UNIT
Supply voltage, VCC 3 3.3 3.6 V
Receiver input voltage GND 3 V
Operating free air temperature, TA −40 25 85 °C

6.4 Thermal Information

THERMAL METRIC(1) DS90LV048A UNIT
PW (TSSOP)
16 PINS
RθJA Junction-to-ambient thermal resistance 110.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 47 °C/W
RθJB Junction-to-board thermal resistance 54.7 °C/W
ψJT Junction-to-top characterization parameter 6.1 °C/W
ψJB Junction-to-board characterization parameter 54.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

Over Supply Voltage and Operating Temperature ranges, unless otherwise specified.(1)(2)
PARAMETER TEST CONDITIONS PIN MIN TYP MAX UNIT
VTH Differential input high threshold VCM = +1.2 V, 0.05 V, 2.95 V(3) RIN+, RIN− −35 0 mV
VTL Differential input low threshold −100 −35 mV
VCMR Common-mode voltage range VID = 200 mV peak to peak?(4) 0.1 2.3 V
IIN Input current VIN = +2.8 V VCC = 3.6 V or 0 V −10 ±5 10 μA
VIN = 0 V −10 ±1 10
VIN = +3.6 V VCC = 0 V –20 ±1 20
VOH Output high voltage IOH = −0.4 mA, VID = +200 mV ROUT 2.7 3.3 V
IOH = −0.4 mA, input terminated 2.7 3.3
IOH = −0.4 mA, input shorted 2.7 3.3
VOL Output low voltage IOL = 2 mA, VID = −200 mV 0.05 0.25 V
IOS Output short-circuit current Enabled, VOUT = 0 V(5) −15 −47 −100 mA
IOZ Output TRI-STATE current Disabled, VOUT = 0 V or VCC −10 ±1 10 μA
VIH Input high voltage EN, EN* 2 VCC V
VIL Input low voltage GND 0.8 V
II Input current VIN = 0 V or VCC, other Input = VCC or GND −10 ±5 10 μA
VCL Input clamp voltage ICL = −18 mA −1.5 −0.8 V
ICC No load supply current
receivers enabled 		EN = VCC, inputs open VCC 9 15 mA
ICCZ No load supply current
receivers disabled		 EN = GND, inputs open 1 5 mA
(1) Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground unless otherwise specified.
(2) All typicals are given for: VCC = 3.3 V, TA = 25°C.
(3) VCC is always higher than RIN+ and RIN− voltage. RIN− and RIN+ are allowed to have a voltage range −0.2 V to VCC− VID/2. However, to be compliant with AC specifications, the common voltage range is 0.1 V to 2.3 V.
(4) The VCMR range is reduced for larger VID. Example: if VID = 400 mV, the VCMR is 0.2 V to 2.2 V. The fail-safe condition with inputs shorted is not supported over the common-mode range of 0 V to 2.4 V, but is supported only with inputs shorted and no external common-mode voltage applied. A VID up to VCC – 0 V may be applied to the RIN+/ RIN− inputs with the Common-Mode voltage set to VCC/2. Propagation delay and Differential Pulse skew decrease when VID is increased from 200 mV to 400 mV. Skew specifications apply for 200 mV ≤ VID ≤ 800 mV over the common-mode range.
(5) Output short-circuit current (IOS) is specified as magnitude only; minus sign indicates direction only. Only one output should be shorted at a time; do not exceed maximum junction temperature specification.

6.6 Switching Characteristics

Over Supply Voltage and Operating Temperature ranges, unless otherwise specified.(1)(2)(4)(5)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tPHLD Differential propagation delay high to low CL = 15 pF
VID = 200 mV
(Figure 15 and Figure 16) 		1.2 2 2.7 ns
tPLHD Differential propagation delay low to high 1.2 1.9 2.7 ns
tSKD1 Differential pulse skew |tPHLD − tPLHD|(3) 0 0.1 0.4 ns
tSKD2 Differential channel-to-channel skew; same device(4) 0 0.15 0.5 ns
tSKD3 Differential part-to-part skew(5) 1 ns
tSKD4 Differential part-to-part skew(6) 1.5 ns
tTLH Rise time 0.5 1 ns
tTHL Fall time 0.35 1 ns
tPHZ Disable time high to Z RL = 2 kΩ
CL = 15 pF
(Figure 17 and Figure 18) 		8 14 ns
tPLZ Disable time low to Z 8 14 ns
tPZH Enable time Z to high 9 14 ns
tPZL Enable time Z to low 9 14 ns
fMAX Maximum operating frequency(7) All channels switching 200 250 MHz
(1) All typicals are given for: VCC = 3.3 V, TA = 25°C.
(2) Generator waveform for all tests unless otherwise specified: f = 1 MHz, ZO = 50 Ω, tr and tf (0% to 100%) ≤ 3 ns for RIN.
(3) tSKD1 is the magnitude difference in differential propagation delay time between the positive going edge and the negative going edge of the same channel
(4) tSKD2, channel-to-channel skew is defined as the difference between the propagation delay of one channel and that of the others on the same chip with any event on the inputs.
(5) tSKD3, part-to-part skew, is the differential channel-to-channel skew of any event between devices. This specification applies to devices at the same VCC, and within 5°C of each other within the operating temperature range.
(6) tSKD4, part-to-part skew, is the differential channel-to-channel skew of any event between devices. This specification applies to devices over recommended operating temperature and voltage ranges, and across process distribution. tSKD4 is defined as |Max−Min| differential propagation delay.
(7) fMAX generator input conditions: tr = tf < 1 ns (0% to 100%), 50% duty cycle, differential (1.05-V to 1.35-V peak to peak). Output criteria: 60 / 40% duty cycle, VOL (maximum 0.4 V), VOH (minimum 2.7 V), Load = 15 pF (stray plus probes).

6.7 Typical Characteristics

DS90LV048A 10088812.png Figure 1. Output High Voltage vs Power Supply Voltage
DS90LV048A 10088814.png Figure 3. Output Short-Circuit Current vs Power Supply Voltage
DS90LV048A 10088816.png Figure 5. Differential Transition Voltage vs Power Supply Voltage
DS90LV048A 10088819.png Figure 7. Differential Propagation Delay vs Power Supply Voltage
DS90LV048A 10088821.png Figure 9. Differential Propagation Delay vs Differential Input Voltage
DS90LV048A 10088823.png Figure 11. Differential Skew vs Power Supply Voltage
DS90LV048A 10088825.png Figure 13. Transition Time vs Power Supply Voltage
DS90LV048A 10088813.png Figure 2. Output Low Voltage vs Power Supply Voltage
DS90LV048A 10088815.png Figure 4. Output TRI-STATE Current vs Power Supply Voltage
DS90LV048A 10088818.png Figure 6. Power Supply Current vs Ambient Temperature
DS90LV048A 10088820.png Figure 8. Differential Propagation Delay vs Ambient Temperature
DS90LV048A 10088822.png Figure 10. Differential Propagation Delay vs Common-Mode Voltage
DS90LV048A 10088824.png Figure 12. Differential Skew vs Ambient Temperature
DS90LV048A 10088826.png Figure 14. Transition Time vs Ambient Temperature